Optical Sensor Module Metal Shielding EMI Leakage Reduction

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Solution Overview

Problem

Optical sensor modules face challenges with electromagnetic interference (EMI) issues between the sensor module and host devices, particularly in consumer electronics, which can affect the accuracy and reliability of object detection and distance measurement.

Innovation Solution

The implementation of a substrate assembly for an optical sensor module that includes a light-emitting device mounted on a substrate with a metal shielding assembly. The metal shielding has a first opening for the optical path and is dimensioned to surround and partially cover the light-emitting device, with an absorber layer to enhance EMI protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal shielding assembly is added to reduce EMI, then EMI shielding is improved, but device complexity increases

Engineering Contradiction:
ImproveEMI shieldingVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The light-emitting device is nested inside the metal shielding assembly, with the device positioned within the enclosed space formed by the shielding structure. This integration allows the shielding to protect the device while maintaining a compact form factor.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The metal shielding assembly is prepared with a pre-formed opening before the light-emitting device is installed. This preliminary configuration of the opening simplifies the assembly process and reduces the complexity of post-installation modifications.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If an opening is created in the metal shielding for optical path, then optical function is improved, but EMI shielding deteriorates

Engineering Contradiction:
Improveoptical functionVSAvoidEMI shielding
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The metal shielding assembly features a localized opening specifically positioned and sized to allow optical transmission while maintaining EMI shielding in other areas. The opening's dimensions and location are optimized to balance optical functionality with electromagnetic protection.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The opening in the metal shielding is designed with dimensions that are sufficient for optical transmission but not excessively large, thereby providing partial EMI shielding while maintaining necessary optical function. This balanced approach prevents complete EMI exposure while ensuring optical performance.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces EMI leakage and enhances EMI shielding, preventing interference that could alter the functioning of optical sensor module components and ensuring accurate object detection and distance measurement.

Implementation Method 1

a metal shielding assembly comprising a first metal shielding assembled to the substrate over the first region

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

with an absorber layer to enhance EMI protection

Methodology Applied
Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Implementation Method 3

a first opening providing an optical path for light emitted by the light-emitting device

Methodology Applied
Scientific EffectLight emission: Light

Data Source

PatentUS20250138153A1Optical sensor module
Publication Date: 2025.05.01 STMICROELECTRONICS ASIA PACIFIC PTE
  • US20250138153A1 patent drawing
  • US20250138153A1 patent drawing
  • US20250138153A1 patent drawing

AI summary

The present disclosure provides a substrate assembly for an optical sensor module. An example substrate assembly for an optical sensor module comprising: a light-emitting device mounted on a first region of a substrate; a metal shielding assembly comprising a first metal shielding assembled to the substrate over the first region; and wherein the first metal shielding comprises a first opening providing an optical path for light emitted by the light-emitting device, the first opening being dimensioned such that the light-emitting device can be inserted through the first opening inside the first metal shielding.