Optical Sensor Package with Opaque Cap and Apertures
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Solution Overview
Problem
Optical sensors face issues such as glue shifting, uneven glue application, and contamination due to the use of conventional attachment methods, which lead to inaccurate light sensing and potential damage to components.
Innovation Solution
A protective structure comprising transparent components on adhesive optical films with strategically placed apertures and an opaque cap, preventing light from reaching the sensor without passing through the apertures, and using molding compound to fill gaps, eliminating the need for glue and reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional adhesive glue is used to attach transparent components to integrated circuit dies, then component attachment is achieved, but glue shifting and uneven glue application occur leading to manufacturing defects
Solution Approach 1:
The patent removes the adhesive glue layer from the optical path between the transparent component and integrated circuit die. By eliminating the glue entirely and using direct bonding or alternative attachment methods that do not require UV-curing adhesive in the light path, the invention prevents glue shifting, uneven application, and contamination issues while maintaining component attachment.
Solution Approach 2:
The patent introduces a reflective layer as an intermediary between the transparent component and the integrated circuit die. This reflective layer enables the desired optical function (reflecting light back through the transparent component) without requiring adhesive glue in the optical path, thereby eliminating glue-related manufacturing defects.
2Object-affected harmful factors
If transparent mold component is used to cover the adhesive, then component protection is achieved, but the adhesive is only partially cured due to ultraviolet filtering
Solution Approach 1:
The patent eliminates the adhesive layer that requires UV curing from the optical path. By removing the glue entirely or replacing it with an adhesive that does not require UV curing, the invention prevents the partial curing issue caused by the transparent mold component's UV filtering properties, ensuring complete bonding reliability.
3Use of energy by moving object
If openings are left between integrated circuit dies and MEMS cap, then light transmission is enabled, but damage and contamination of integrated circuit dies occur
Solution Approach 1:
The patent merges the transparent component with the protective structure to create an integrated solution. By combining the light-transmitting function and protection function into a single integrated component design, the invention eliminates the need for separate openings that expose integrated circuit dies to contamination while maintaining necessary light transmission paths.
Solution Approach 2:
The patent introduces a reflective layer as an intermediary that enables light transmission through a different optical path. Instead of leaving openings that expose components to contamination, the reflective layer guides light through controlled paths that maintain protection while enabling the necessary optical functionality.
4Use of energy by moving object
If laser drilling is used to form openings in molding compound, then light transmission paths are created, but additional manufacturing expense and component damage occur
Solution Approach 1:
The patent incorporates the light transmission function into the molding compound design itself during the molding process. By pre-forming the molding compound with integrated light-transmitting characteristics or integrated optical paths during the original molding operation, the invention eliminates the need for subsequent laser drilling operations, reducing manufacturing cost and complexity while preventing component damage.
Solution Approach 2:
The patent merges the light transmission function with the protective molding compound structure. By integrating the optical function directly into the protective component rather than adding it through separate drilling operations, the invention simplifies manufacturing and reduces costs while maintaining protection against component damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures precise light transmission, prevents glue-related issues, and enhances the robustness and accuracy of optical sensors by maintaining component alignment and protecting against moisture and thermal damage.
Implementation Method 1
a first adhesive transparent optical film (36) allowing light to pass therefrom to the transparent component (34a, 34b)
Implementation Method 2
An opaque cap (56) is positioned on the transparent component (34a, 34b). The opaque cap (56) includes a first aperture (42) and a second aperture (44).
Implementation Method 3
Molding compound is positioned in the opening between the first and second portions of the transparent component (34a, 34b).
Implementation Method 4
a second integrated circuit die (26) on the substrate (22). The second integrated circuit die (26) includes a light emitting portion (29).
Implementation Method 5
a first integrated circuit die (24) on the substrate (22). The first integrated circuit die (24) includes a light sensor (27).
Data Source
AI summary
A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.