Optical Sensor Packaging Unit with Patterning Spacers
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Solution Overview
Problem
Existing packaging methods for optical sensors often cause damage during storage and transportation due to high precision requirements, and the separation of packaging structures from the sensor substrates can be difficult, leading to further damage.
Innovation Solution
A packaging unit with a bonding substrate and spacers formed through patterning, where the bonding substrate has packaging regions for sealant application, and alignment marks facilitate easy alignment and separation without damaging the optical sensor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical sensors are packaged for storage and transportation, then the sensors are protected from damage, but the packaging structure may cause damage to the sensor elements during separation
Solution Approach 1:
The packaging structure is divided into multiple layers including a base substrate, packaging substrate, and sealant layer. The spacers are separately formed on the packaging substrate, creating distinct functional segments that can be applied and removed independently, reducing the risk of damage during separation
Solution Approach 2:
Spacers are introduced as intermediary elements between the packaging substrate and the sensor elements. These spacers create a protective barrier and controlled interface that prevents direct contact and potential damage during the packaging and separation processes
2Manufacturing precision
If alignment marks are added to facilitate alignment, then the alignment precision is improved, but the manufacturing complexity increases
Solution Approach 1:
Alignment marks are integrated into the packaging substrate during the same patterning process used to create the spacers. This merging of functions allows alignment features to be added without requiring separate manufacturing steps, thus improving alignment precision while minimizing increases in manufacturing complexity
3Manufacturing precision
If spacers are formed through patterning process, then the positioning precision is improved, but the manufacturing process complexity increases
Solution Approach 1:
The spacers and alignment marks are both formed through the same patterning process on the packaging substrate. This combined approach achieves precise spacer positioning while avoiding the need for separate manufacturing steps, thereby maintaining ease of manufacture despite the precision requirements
Data Source
AI summary
A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the bonding substrate through a patterning process, wherein the bonding substrate is reserved with packaging regions for applying sealant. When the packaging unit is used to package a component, because the spacer(s) is supported between the bonding substrate and the base substrate, the packaging unit is easy to separate from the base substrate At the same time, the packaging unit has little or no damage to the base substrate and elements formed on the base substrate, thus effectively protecting the performance of the base substrate and the elements on the base substrate.