Optical Sensor PCB Layout for Compact Image Forming Attachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a challenge in miniaturizing toner pattern sensors used in color image forming apparatuses due to the presence of electronic components like light-emitting elements, light-receiving elements, control ICs, and connectors on printed circuit boards, which makes it difficult to avoid interference with supporting members.
Innovation Solution
The solution involves an image forming apparatus with an optical sensor mounted on a printed circuit board, where the light-emitting and light-receiving elements are on one surface and the electronic components for driving these elements are on the opposite surface. A supporting member with a through-hole accommodates the electronic component, reducing interference and allowing for stable attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are mounted on the printed circuit board of the toner pattern sensor, then the sensor can perform its measurement function, but the sensor cannot be miniaturized due to interference with the supporting member
Solution Approach 1:
The patent applies dimensionality change by moving electronic components from the front surface to the back surface of the printed circuit board. This spatial reorganization allows the sensor to be miniaturized without interference between electronic components and the supporting member, as they now occupy different spatial planes.
Solution Approach 2:
The patent segments the printed circuit board into two functional surfaces: the front surface for mounting optical components (light-emitting element and light-receiving element) and the back surface for mounting electronic components. This segmentation resolves the interference issue by separating different component types into distinct spatial zones.
2Volume of moving object
If the toner pattern sensor is miniaturized, then space is saved in the image forming apparatus, but it becomes difficult to avoid interference between electronic components and the supporting member
Solution Approach 1:
By relocating electronic components to the back surface of the printed circuit board, the patent enables miniaturization while maintaining attachment stability. The dimensional separation ensures that electronic components do not protrude into the space between the sensor and supporting member, preventing interference and ensuring reliable attachment.
Solution Approach 2:
The patent extracts electronic components from the front surface of the printed circuit board and relocates them to the back surface. This extraction removes the source of potential interference, allowing the sensor to be miniaturized while maintaining stable attachment to the supporting member.
3Ease of manufacture
If electronic components are mounted on the front surface of the printed circuit board, then assembly is simplified, but the sensor cannot be miniaturized due to component interference
Solution Approach 1:
The patent uses dimensionality change to resolve the contradiction between assembly simplicity and miniaturization. By mounting electronic components on the back surface and optical components on the front surface, the patent achieves miniaturization without complicating assembly, as each surface can be populated independently with appropriate components.
Solution Approach 2:
The patent segments the mounting surfaces of the printed circuit board into front and back surfaces, with each surface dedicated to specific component types. This segmentation enables miniaturization by eliminating interference, while assembly remains straightforward as components are mounted on their respective surfaces without requiring complex routing or repositioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of the toner pattern sensor while ensuring that the electronic components do not interfere with the supporting member, thereby stabilizing the attachment and improving the accuracy of image formation and density correction.
Implementation Method 1
a light-emitting element mounted on the first mounting surface of the printed circuit board
Implementation Method 2
a light-receiving element mounted on the first mounting surface of the printed circuit board
Data Source
AI summary
An image forming apparatus includes an optical sensor configured to measure reflected light from a test image on the image carrier. The optical sensor includes a printed circuit board, with a light-emitting element provided on a first surface of the printed circuit board, and with the light-emitting element being configured to irradiate the test image on the image carrier with light. The optical sensor also includes a light-receiving element provided on the first surface of the printed circuit board, with the light-receiving element being configured to receive the reflected light from the test image on the image carrier. A connector is provided on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, with a cable for controlling the optical sensor being connected to the connector. A support member is configured to support the optical sensor so that the first surface of the printed circuit board faces a surface of the image carrier, and a controller is configured to control the image forming unit based on a result of the reflected light from the test image measured by the optical sensor. A direction in which the cable is inserted into the connector is orthogonal to the second surface of the printed circuit board.