Optical Sensor TSV Packaging With Sawed Vias and Exposed Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current fabrication processes for integrated circuit (IC) sensor packages are complex, slow, and costly, particularly for optical sensors, as they require drilling through silicon vias, which is not easily adaptable to different designs or package sizes, leading to increased design and manufacturing costs and time.
Innovation Solution
The method involves forming through silicon vias (TSV) in an array of IC sensor packages and using a blade sawing process to singulate them, forming external conductive terminals during fabrication, allowing the sensor to be exposed to the environment while protecting other circuitry, and providing a connection to an external board via solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If drilling through silicon vias is used to fabricate IC sensor packages, then reliable electrical connections are achieved, but the fabrication process becomes complex, slow, and costly
Solution Approach 1:
The patent replaces the mechanical drilling process with a blade sawing process to form through-silicon vias. Instead of using drill bits to create holes through the silicon substrate, a blade saw is used to cut the vias and singulate the packages simultaneously, thereby simplifying the fabrication process while maintaining reliable electrical connections.
Solution Approach 2:
The patent combines the through-silicon via formation process with the package singulation process into a single blade sawing operation. Normally, vias would be drilled before singulation, but this invention performs both operations together, reducing the total number of fabrication steps and decreasing manufacturing time and cost.
2Reliability
If drilling through silicon vias is used to fabricate IC sensor packages, then reliable electrical connections are achieved, but manufacturing time and costs increase
Solution Approach 1:
The patent combines the through-silicon via formation process with the package singulation process into a single blade sawing operation. Normally, vias would be drilled before singulation, but this invention performs both operations together, reducing the total number of fabrication steps and decreasing manufacturing time and cost.
Solution Approach 2:
The patent replaces the mechanical drilling process with a blade sawing process to form through-silicon vias. Instead of using drill bits to create holes through the silicon substrate, a blade saw is used to cut the vias and singulate the packages simultaneously, thereby simplifying the fabrication process while maintaining reliable electrical connections.
3Adaptability or versatility
If the sensor is exposed to the environment, then environmental property measurement is enabled, but the circuitry must be protected from environmental damage
Solution Approach 1:
The patent divides the device into distinct functional regions: an exposed sensor area that interfaces with the environment for measurement, and a protected circuitry area that remains enclosed. The through-silicon vias are positioned to provide electrical connections between these regions while the sensor remains accessible to environmental stimuli and the circuitry remains protected.
4Reliability
If conventional fabrication methods are used, then reliable electrical connections are achieved, but design and manufacturing costs increase
Solution Approach 1:
The patent combines the through-silicon via formation process with the package singulation process into a single blade sawing operation. Normally, vias would be drilled before singulation, but this invention performs both operations together, reducing the total number of fabrication steps and decreasing manufacturing time and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and accelerates the fabrication process, reduces costs, and enables efficient production of IC sensor packages with exposed sensors for environmental property measurement, while maintaining protection of circuitry and facilitating cost-effective design variations.
Implementation Method 1
A metal plating layer is deposited in the channel openings and is electrically coupled to the contact surface of the electrical interconnects
Data Source
AI summary
An electronic device includes a substrate and a die having an active surface where the die is disposed on the substrate. A sensor is disposed on the active surface of the die such that the sensor is exposed to an external environment. Electrical interconnects are disposed on the active surface of the die near a perimeter of the die. Conductive terminals have a first end attached to a contact surface of the electrical interconnects and a second end that attaches to an external terminal.