Optical Sensor Housing With Shading Coating for Noise Light Blocking

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Solution Overview

Problem

Existing optical sensor module packaging methods are complex, prone to damage, and limit miniaturization due to the use of opaque lids and transparent plastic materials, which increase production difficulties and reduce design flexibility.

Innovation Solution

The use of a transparent material housing with a shading coating layer for the optical sensor module, eliminating the need for opaque lids and complex cutting processes, while protecting the light-sensing and light-emitting devices from noise light and external contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If opaque lids are used to protect light-sensing devices from noise light, then protection from noise light is improved, but packaging process complexity increases and miniaturization is limited

Engineering Contradiction:
Improvenoise light interferenceVSAvoidpackaging process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The housing is divided into different functional regions: transparent regions for light transmission and opaque/shaded regions for noise light blocking. This segmentation allows each region to perform its specific function without requiring separate opaque lid components, simplifying the overall packaging structure while maintaining protection from noise light.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protective housing and noise light shielding functions are merged into a single integrated transparent housing structure with shaded regions. Instead of using separate opaque lids and transparent packaging materials as in prior art, the housing itself provides both protection and noise light filtering through its multi-region design, reducing assembly steps and process complexity.

Inventive Principle:
Principle #5Merging (Combining)

2Strength

If transparent plastic material is used to envelop light-sensing and light-emitting devices, then device protection is improved, but cutting processes are required which increase complexity and risk of damage

Engineering Contradiction:
Improvedevice protectionVSAvoidpackaging manufacturing ease
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The housing is designed with segmented regions (transparent and opaque) that are formed as an integrated structure. This eliminates the need for post-molding cutting operations to create openings for light transmission, as the transparent and opaque regions are defined during the molding process itself, significantly simplifying manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing structure with its transparent and opaque regions is pre-formed in a single molding process before device assembly. This preliminary formation of the complete housing structure eliminates subsequent cutting and assembly steps, reducing manufacturing complexity and the risk of damage to sensitive optical components.

Inventive Principle:
Principle #10Preliminary action

3Object-affected harmful factors

If opaque lids are used for batch packaging, then noise light filtering is improved, but wire bonding space is occupied and miniaturization is hindered

Engineering Contradiction:
Improvenoise light filteringVSAvoidpackage size
Core Design Contradiction:
Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The noise light filtering function is merged into the housing structure itself through shaded regions, eliminating the need for separate opaque lid components. This integration removes the additional space required for separate filtering components, enabling miniaturization while maintaining noise light protection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing utilizes vertical layering with transparent and opaque regions arranged in different spatial zones. This dimensional arrangement allows noise light filtering to occur in specific regions without occupying horizontal wire bonding space, enabling both protection and miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Adaptability or versatility

If additional optical structures are manufactured as independent modules and bonded to opaque lids, then optical functionality is improved, but component number and assembly steps increase

Engineering Contradiction:
Improveoptical structure functionalityVSAvoidcomponent number and assembly steps
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Optical structures such as lenses are integrated directly into the housing structure as unified components rather than separate modules. The housing itself forms part of the optical path, eliminating the need for independent optical modules and their associated bonding processes, thereby reducing component count and assembly complexity while maintaining optical functionality.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the packaging process, increases production yield, enables miniaturization, and enhances design flexibility for optical structures, reducing manufacturing difficulties and component complexity.

Implementation Method 1

The housing includes a shading coating layer on the inner surface facing the substrate and outside the light-receiving region

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

an optical sensor module comprises a substrate and a housing made of a transparent material

Methodology Applied
Scientific EffectLight transmission: Refraction

Data Source

PatentUS12013284B2Optical sensor module and packaging method thereof
Publication Date: 2024.06.18 SENSORTEK TECH
  • US12013284B2 patent drawing
  • US12013284B2 patent drawing
  • US12013284B2 patent drawing

AI summary

An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.