Optical Sensor EMI Shield Structure for Crosstalk and Gap Reduction
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Solution Overview
Problem
Conventional EMI shielding methods for optical sensors face challenges such as increased component and assembly costs, larger footprints due to rounded corners, gaps leading to reduced shielding effectiveness, and internal cross-talk between electrical components, especially at higher frequencies.
Innovation Solution
The use of multiple EMI shields with protrusions and apertures to form localized conductive envelopments around electrical components, coupled with a lens alignment, provides effective shielding while reducing material and assembly costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple metal cans are used to reduce footprint, then footprint is reduced, but gaps are introduced leading to increased EMI
Solution Approach 1:
The patent merges multiple separate EMI shielding functions into a single integrated EMI shield structure. This single shield incorporates multiple apertures positioned to align with multiple electrical components, eliminating the need for multiple separate metal cans while maintaining continuous shielding without gaps.
Solution Approach 2:
The EMI shield serves multiple functions simultaneously: it provides EMI shielding for multiple electrical components through its apertures, acts as a structural support element, and functions as a spacer to maintain precise spacing between the lens and electrical components. This multi-functionality reduces the number of separate components needed.
2Object-affected harmful factors
If conventional EMI shielding is introduced into packaging, then EMI shielding is provided, but internal EMI crosstalk between electrical components is not prevented
Solution Approach 1:
The EMI shield features locally differentiated properties through its apertures, which are strategically positioned and sized to allow optical signals to pass to specific electrical components while blocking EMI. Each aperture region provides tailored shielding characteristics for its corresponding component, enabling selective EMI protection while maintaining component isolation.
3Ease of manufacture
If stamping fabrication techniques are used, then metal cans are fabricated, but sharp corners cannot be formed leading to increased footprint
Solution Approach 1:
The patent transitions from two-dimensional planar shielding to three-dimensional volumetric shielding by positioning the EMI shield above the substrate plane. This vertical dimensionality allows the shield to cover multiple components while maintaining a compact footprint, as the shielding extends upward rather than requiring additional horizontal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances EMI shielding performance, reduces material and assembly costs, and improves space efficiency by using EMI shields as spacers, minimizing gaps and internal cross-talk.
Implementation Method 1
EMI shielding creates a Faraday cage effect which attenuates radiation of electromagnetic (EM) waves and/or reduces a likelihood of EM emissions from circuit components
Implementation Method 2
a lens coupled to the first EMI shield, wherein the lens is positioned above the first electrical component
Data Source
AI summary
Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.