Optical Sensor Package Stacked Substrate Integration
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Solution Overview
Problem
Conventional proximity sensor packages require separate components for light-emitting and light-receiving diodes, which increase the footprint and complexity when integrated with image sensor processors, limiting their compactness and efficiency in electronic devices.
Innovation Solution
A system-in-package (SiP) design with a stacked arrangement of optical devices, including a light-emitting diode and a light-receiving diode, secured to substrates over an image sensor processor, allowing for a compact and integrated optical package with a cap that acts as a light barrier to enhance radiation emission and reception efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate components for light-emitting and light-receiving diodes are used, then the functional requirements are met, but the footprint and complexity increase
Solution Approach 1:
The patent merges the light-emitting diode and light-receiving diode into a single integrated optical package, where both components are mounted on the same substrate and share common structural elements such as the cap and mounting bracket. This integration reduces the overall footprint while maintaining the functional separation needed for proximity sensing operations.
Solution Approach 2:
The patent employs a nested structure where the light-emitting diode and light-receiving diode are positioned within a shared cap structure, and the entire optical assembly is integrated with the image sensor processor package. The cap serves as a nested container that provides structural support and light barrier functions for both diodes simultaneously.
2Reliability
If separate components for light-emitting and light-receiving diodes are used, then the functional requirements are met, but the device complexity increases
Solution Approach 1:
The patent combines multiple functional elements into a unified structure. The cap serves dual purposes as both a structural support element and a light barrier. The mounting bracket integrates the positioning function for both diodes. This merging of functions reduces the number of separate components and simplifies the overall device architecture.
Solution Approach 2:
The cap structure is designed as a multi-functional component that provides structural support, light barrier functionality, and positioning for both the light-emitting diode and light-receiving diode. This universal component performs multiple functions that would otherwise require separate elements, thereby reducing device complexity.
3Area of stationary object
If a stacked arrangement is used, then the footprint is reduced, but the integration complexity increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The light-emitting diode and light-receiving diode are positioned at different vertical levels within the package, with the cap structure providing vertical support and positioning. This dimensional change allows compact integration while managing complexity through structured layering.
4Reliability
If the cap acts as a light barrier, then the radiation emission and reception efficiency is enhanced, but the structural complexity increases
Solution Approach 1:
The light barrier function is merged into the cap structure itself, eliminating the need for separate light barrier components. The cap is designed with light-blocking properties that enhance radiation emission and reception efficiency while serving its primary structural support function, thereby avoiding additional structural complexity.
Solution Approach 2:
The cap is designed as a multi-functional component that simultaneously provides structural support and acts as a light barrier. This universal design enhances radiation efficiency without requiring additional dedicated light barrier structures, thus avoiding increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SiP design reduces the overall footprint, enhances radiation emission and reception efficiency, and allows for more compact integration in electronic devices while maintaining the same size footprint as previous image sensor processor packages, improving the detection of nearby objects.
Implementation Method 1
the LED emits radiation out a first opening in the sensor package
Implementation Method 2
The photodiode receives the reflected radiation and generates an electrical signal indicative of the received radiation
Data Source
AI summary
One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.