Silicon Mirror Redirection Structure for Precise Fiber Coupling
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Solution Overview
Problem
Inaccurate formation and positioning of mirror structures in semiconductor photonics devices due to insufficient geometric properties of planar silicon surfaces formed using dry etch operations lead to optical signal loss and decreased coupling performance with output optical fibers.
Innovation Solution
Utilizing a wet chemical etch operation to expose a crystal grain orientation on the planar silicon surface, enhancing the geometric properties and improving the flatness and angle of the silicon surface, which allows for a mirror structure to be accurately positioned and parallel to the surface, thereby reducing optical signal loss during redirection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry etch operation is used to form the planar silicon surface, then the manufacturing process is simpler and faster, but the geometric properties (flatness and angle) are insufficient leading to optical signal loss
Solution Approach 1:
The patent changes the etching method from dry etching to wet chemical etching, which fundamentally alters the etching parameters and mechanism. This parameter change enables achieving superior geometric properties (flatness and angle) of the planar silicon surface that cannot be obtained through dry etching alone.
2Reliability
If the mirror structure is positioned with insufficient geometric precision, then the manufacturing process is easier, but optical signal loss increases and coupling performance decreases
Solution Approach 1:
The patent performs preliminary action by first creating a planar silicon surface with excellent geometric properties through wet chemical etching before positioning the mirror structure. This preliminary preparation of the substrate surface ensures that subsequent mirror positioning achieves the required precision for optimal optical coupling performance.
3Manufacturing precision
If wet chemical etch operation is used to expose crystal grain orientation, then the geometric properties and flatness of silicon surface are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent employs wet chemical etching instead of dry etching, representing a fundamental parameter change in the etching process. This parameter change enables the exposure of crystal grain orientation and achieves superior flatness and geometric properties of the planar silicon surface, despite the increased process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved geometric properties of the planar silicon surface using a wet chemical etch operation enhance the coupling performance between the semiconductor photonics device and the output optical fiber, reducing optical signal loss and increasing operating efficiency.
Implementation Method 1
forming the planar silicon surface using a wet chemical etch operation
Implementation Method 2
The mirror structure redirects the modulated optical signal received from a first direction to a second direction that is toward the output optical fiber
Data Source
AI summary
Some implementations herein provide an optical signal redirection structure. The optical signal redirection structure includes a planar silicon surface having a <110> crystal grain orientation. The optical signal redirection structure includes a dielectric region over the planar silicon surface. The optical signal redirection structure includes a mirror structure suspended in the dielectric region, where the mirror structure is approximately parallel to the planar silicon surface.