Optical SiP with Inclined Submount for Laser Alignment and Cooling
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Solution Overview
Problem
Existing methods face challenges in efficiently packaging edge-type light-emitting laser diodes for long-distance optical transmission, requiring complex optical systems and heat dissipation structures that interfere with the optical path, and struggle with precise alignment and integration of optical and electronic components.
Innovation Solution
An optical system-in-package (O-SIP) design that includes an edge-type light-emitting laser diode and driver IC in a mold body with a redistribution layer, allowing for direct assembly of a planar light circuit, efficient optical coupling using a grating coupler, and integrated heat dissipation through metal structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If edge-type light-emitting laser diode is used for long-distance transmission, then transmission distance is improved, but alignment precision requirement increases
Solution Approach 1:
The patent introduces an inclined submount as an intermediary component between the edge-type laser diode and the optical fiber. The submount's inclined surface (45 degrees) converts the lateral light emission into vertical emission, serving as a mediator that simplifies the alignment process while maintaining long-distance transmission capability
Solution Approach 2:
The patent changes the emission dimension by using an inclined submount to convert lateral light emission (x-direction) into vertical light emission (z-direction). This dimensional transformation allows the laser diode to emit light perpendicular to the package surface, making alignment with optical fibers easier and more precise
2Temperature
If heat dissipation structure is added to laser diode package, then heat dissipation performance is improved, but optical path interference increases
Solution Approach 1:
The patent employs asymmetric heat dissipation structures with different configurations on opposite sides of the package. The first heat dissipation structure on the laser diode side uses a specific pattern that directs heat away from the optical path, while the second heat dissipation structure on the opposite side provides complementary heat dissipation without interfering with light emission
Solution Approach 2:
The patent applies local quality by designing heat dissipation structures with varying properties in different regions. The heat dissipation structures are configured with different patterns and materials in areas close to the optical path versus areas farther away, allowing effective heat dissipation while minimizing optical interference in critical regions
3Adaptability or versatility
If multiple optical components are integrated in package, then device functionality is improved, but assembly complexity increases
Solution Approach 1:
The patent merges multiple optical components (laser diode, optical fiber, collimation lens, and heat dissipation structures) into a single integrated package. The inclined submount serves as a common mounting platform that combines mechanical support, optical alignment, and heat dissipation functions, reducing the number of separate assembly steps
Solution Approach 2:
The patent implements multi-functionality through the inclined submount, which simultaneously serves as a mechanical support structure, an optical alignment element (converting lateral to vertical emission), and a heat dissipation pathway. This universal component reduces assembly complexity by eliminating the need for separate structures for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and accurate integration of optical and electronic components, reduces assembly complexity and cost, and enhances heat dissipation, enabling high-performance optical modules with minimal size and signal loss.
Implementation Method 1
efficient optical coupling using a grating coupler
Implementation Method 2
an edge-type light-emitting laser diode molded inside the mold body and mounted on the inclined surface of the submount to emit an optical signal to the first surface
Data Source
AI summary
Provided is an optical system-in-package where an edge-type light-emitting laser diode and a driver IC are included in the package, and a planar light circuit chip is assembled directly on a redistribution layer or through a main printed circuit board, and an optical module and an optical transceiver using same. The optical system-in-package includes a mold body having planar first and second surfaces on the upper and lower portions of the mold body, respectively, a submount molded inside the mold body and having a side surface having an inclined surface, an edge-type light-emitting laser diode molded inside the mold body and mounted on the inclined surface of the submount to emit an optical signal to the first surface, and a redistribution layer formed on the first surface of the mold body and connected to a plurality of external connection terminals to electrically connect the edge-type light-emitting laser diode to outside.