Optical Soldering Controller Layout for Compact Precision Alignment
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Solution Overview
Problem
Conventional non-contact soldering devices are bulky, complex, and prone to accuracy issues due to independent installation of optical and soldering components, which complicates adjustments and reduces precision, especially when used on mobile vehicles.
Innovation Solution
Integration of an optical guiding assembly, sensor, and feedback controller as a system controller to create a compact, coaxial optical path system, reducing volume and weight, and separating static and dynamic components to enhance stability and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sensing light beam is collected coaxially, then the optical path and light spot can be aligned, but the adjustment is very complicated and takes considerable time and labor cost
Solution Approach 1:
The patent merges the light source and sensing module into a single integrated assembly where the sensing light beam is collected non-coaxially. This integration eliminates the need for complex coaxial alignment adjustments while maintaining measurement precision through the integrated design structure.
Solution Approach 2:
Instead of collecting the sensing light beam coaxially as conventionally done, the patent inverts the approach by collecting it non-coaxially. This inversion simplifies the optical system design and reduces adjustment complexity while achieving the desired alignment through the integrated assembly structure.
2Device complexity
If the sensing light beam is collected non-coaxially, then the adjustment is simplified, but the volume of the optical components will be even larger
Solution Approach 1:
The patent combines the light source, optical guiding assembly, and sensing module into a single integrated unit. This merging allows the use of non-coaxial light collection with simplified adjustment while reducing the overall volume compared to separate coaxial systems.
Solution Approach 2:
The optical guiding assembly is nested within the integrated structure, with the sensing module positioned to receive light through the optical guiding assembly. This nesting arrangement minimizes the overall volume of optical components while maintaining the non-coaxial collection advantage.
3Adaptability or versatility
If the light source and soldering module are independently installed, then they can be adjusted separately, but after long period of operation adjustment is required and accuracy is easily reduced due to tolerance or assembling problems
Solution Approach 1:
The patent merges the light source, optical guiding assembly, and sensing module into a single integrated assembly that moves with the soldering module. This integration eliminates accuracy reduction issues caused by independent installation tolerances and assembling problems, while the entire assembly can still be adjusted as a unit.
4Adaptability or versatility
If the soldering module is installed on a mobile vehicle, then it can reach different positions, but the optical path system must be often adjusted due to positional movement
Solution Approach 1:
The patent integrates the optical guiding assembly and sensing module with the soldering module into a single unit that moves together on the mobile vehicle. This merging eliminates the need for frequent optical path adjustments due to positional movements, as the entire assembly maintains its relative configuration during movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated system controller reduces the overall size and weight of the solder device, enhances accuracy by minimizing instability and load on mobile vehicles, and simplifies maintenance and adjustments.
Implementation Method 1
a light source is utilized to heat the to-be-soldered area
Implementation Method 2
The waveband light is guided to a to-be-soldered area by the solder module for heating to perform a solder operation
Implementation Method 3
the sensor is disposed on another side of the optical guiding assembly relative to the solder module for receiving a sensing light beam and generating a sensing signal according to a sensing result of the sensing light beam
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A solder device (1, 2, 3) includes a light source (11, 21, 31), a solder module (12, 22, 37), an optical guiding assembly (13, 23, 33), a sensor (14, 24, 34) and a feedback controller (15, 25, 35). The light source (11, 21, 31) emits waveband light (L) guided to a to-be-soldered area (32) for heating. The optical guiding assembly (13, 23, 33) is disposed between the light source (11, 21, 31) and the solder module (12, 22, 37), and the waveband light (L) is guided to the solder module (12, 22, 37) by the optical guiding assembly (13, 23, 33). The sensor (14, 24, 34) is disposed on another side of the optical guiding assembly (13, 23, 33) for receiving a sensing light beam (S) and then generating a sensing signal. The sensing light beam (S) is guided to the sensor (14, 24, 34) by the optical guiding assembly (13, 23, 33). The feedback controller (15, 25, 35) is connected with the sensor (14, 24, 34) and the light source (11, 21, 31) for receiving the sensing signal and then controlling the light source (11, 21, 31). The optical guiding assembly (13, 23, 33), the sensor (14, 24, 34) and the feedback controller (15, 25, 35) are integrated as a system controller (16, 26, 36). Therefore, the volume and weight of the solder module (12, 22, 37) are compacted.