Multi-channel Optical Sub-assembly Vertical Signal Routing
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Solution Overview
Problem
Existing optical sub-assemblies for high-speed data transmission in 5G and data center networks face challenges in minimizing signal transmission loss and impedance mismatch due to the need for flexible printed circuit boards, which increase the distance between electrical and optical components.
Innovation Solution
A multi-channel optical sub-assembly design that eliminates the use of flexible printed circuit boards by directly connecting the transmitter optical sub-assembly's package electrode to the printed circuit board's electrode in a vertical configuration, using a package window with transparent material and buried through electrodes to minimize signal transmission distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flexible printed circuit board is used to connect the transmitter optical sub-assembly to the electrical sub-assembly, then flexibility in bonding process is improved, but transmission length of electrical signal increases causing signal loss and reduced frequency bandwidth
Solution Approach 1:
The patent removes the flexible printed circuit board from the system, extracting the problematic intermediate component that caused both bonding flexibility and signal transmission issues. The TOSA package is directly mounted on the PCB, eliminating the FPCB connection path and its associated signal loss.
Solution Approach 2:
The patent merges the TOSA package mounting directly with the PCB structure, combining what were previously separate components (TOSA package and PCB) into a integrated assembly. This direct mounting eliminates the need for FPCB and reduces the electrical connection path length.
2Ease of manufacture
If a flexible printed circuit board is used to connect the transmitter optical sub-assembly to the electrical sub-assembly, then bonding process flexibility is improved, but impedance mismatch occurs due to inter-electrode alignment error
Solution Approach 1:
The patent removes the flexible printed circuit board from the system, extracting the problematic intermediate component that caused both bonding flexibility and signal transmission issues. The TOSA package is directly mounted on the PCB, eliminating the FPCB connection path and its associated signal loss.
Solution Approach 2:
The patent introduces a new intermediary structure - a package feedthrough with electrode directly embedded in the PCB - that serves as the connection medium between TOSA and PCB. This mediator provides both mechanical support and precise electrical alignment, replacing the FPCB's intermediary role with improved precision.
3Loss of energy
If the distance between package electrode and PCB electrode is reduced, then signal transmission loss and impedance mismatch are minimized, but bonding process flexibility is reduced
Solution Approach 1:
The patent transitions from a horizontal connection approach (using FPCB to bridge distance) to a vertical integration approach (direct PCB mounting). By changing the dimensional arrangement, the electrical connection path is shortened vertically while the overall package structure maintains manufacturing accessibility.
Solution Approach 2:
The patent introduces a new intermediary structure - a package feedthrough with electrode directly embedded in the PCB - that serves as the connection medium between TOSA and PCB. This mediator provides both mechanical support and precise electrical alignment, replacing the FPCB's intermediary role with improved precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces signal transmission loss and impedance mismatch, enhancing frequency bandwidth and reducing power consumption, while also improving heat dissipation and reliability through the use of a noncontact laser soldering process.
Implementation Method 1
a package window (202) mounted on the printed circuit board, the package window including a transparent material
Implementation Method 2
a high-energy laser passing through the package window including the transparent material upward exposed by the groove
Implementation Method 3
improving heat dissipation and reliability through the use of a noncontact laser soldering process
Data Source
AI summary
A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.