Optical Component Package With Sub-Substrate Cavity
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Solution Overview
Problem
Existing LED packages face challenges in mounting multiple LED chips in series due to the need for multiple insulating layers and separate cooling devices, which increase manufacturing time and package size, and require additional space for heat dissipation.
Innovation Solution
An optical component package with a main substrate and sub-substrate configuration, where the sub-substrate is electrically connected to the main substrate via vertical insulation and metal pads, allowing for flip chip mounting of multiple optical components in series, parallel, or series-parallel configurations, and incorporating a through hole for fluid-based heat dissipation without a separate heat dissipation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insulating layers are provided on metal substrates to mount multiple LED chips in series, then electrical insulation between substrates is improved, but manufacturing time increases due to sequential assembly requirements
Solution Approach 1:
The patent combines multiple metal substrates into a single integrated substrate with multiple insulating layers formed sequentially during fabrication. This merging approach allows multiple LED chips to be mounted simultaneously in series connection without requiring sequential assembly of separate substrates, thereby reducing manufacturing time while maintaining electrical insulation through the integrated insulating layer structure.
Solution Approach 2:
The patent applies preliminary action by pre-forming multiple insulating layers and conducting patterns on the metal substrate before mounting the LED chips. This preliminary preparation of the substrate structure enables simultaneous mounting of multiple chips in series configuration, eliminating the need for sequential assembly operations and reducing overall manufacturing time.
2Reliability
If a sub-substrate is provided only in a portion of the cavity to include wire mounting surface, then electrical connection is improved, but the number of LED chips that can be mounted is reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar sub-substrate to a three-dimensional structure by forming insulating layers at different heights and levels within the cavity. This dimensional change allows the sub-substrate to extend across the entire cavity area while maintaining wire mounting surfaces at appropriate levels, thereby increasing the number of LED chips that can be mounted without compromising electrical connection reliability.
Solution Approach 2:
The patent applies nesting by placing the sub-substrate with wire mounting surfaces within the larger cavity structure of the metal substrate. The sub-substrate is nested in such a way that it occupies only the necessary portion of the cavity while leaving sufficient space around it for mounting multiple LED chips, thus maximizing chip density while maintaining electrical connection functionality.
3Temperature
If a separate cooling block is provided for heat dissipation, then thermal management is improved, but package size increases
Solution Approach 1:
The patent merges the cooling function with the existing metal substrate by forming cooling channels and fluid flow paths within the substrate structure itself. This integration eliminates the need for a separate cooling block, as the metal substrate simultaneously serves as both the electrical connection substrate and the thermal management component, thereby maintaining effective heat dissipation while reducing overall package size.
Solution Approach 2:
The patent applies multi-functionality by designing the metal substrate to perform multiple functions: electrical connection, mechanical support, and thermal management. By incorporating cooling channels and fluid flow paths directly into the substrate, it becomes a universal component that handles both electrical and thermal aspects, eliminating the need for separate dedicated cooling components and reducing package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat dissipation of optical components without additional space, increases the number of LED chips that can be mounted, and reuses fluid for both sterilization and heat dissipation, reducing package size and manufacturing time.
Implementation Method 1
a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component
Implementation Method 2
incorporating a through hole for fluid-based heat dissipation
Data Source
AI summary
An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.