Optical Substrate Chip Carrier Recess Alignment
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Solution Overview
Problem
Current technologies face challenges in scaling up optical circuitry designs for Multi-Chip Modules (MCMs) with multiple optical components, where high-frequency signals require minimizing wire bond lengths between optical drivers and package leads, but existing methods struggle to fabricate optical components and drivers on the same die, leading to inefficient signal conduction.
Innovation Solution
An optical multi-chip module design featuring a leaded package with a printed circuit board (PCB) that includes pre-configured recesses for optical component alignment, microlenses for beam expansion, and a cover assembly with optical ports and fiber ports to minimize wire bond lengths and enable efficient electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical components and drivers are fabricated on separate dies, then manufacturing complexity is reduced, but wire bond length increases leading to signal conduction degradation
Solution Approach 1:
The patent divides the optical module into separate functional components (optical components on optical die, drivers on driver die, electrical interfaces on electrical die) that are independently fabricated and then assembled together through precise alignment mechanisms, resolving the contradiction between separate fabrication ease and connected signal efficiency
Solution Approach 2:
The patent introduces intermediary structures including alignment marks, recesses, and bonding interfaces that mediate between separately fabricated dies, enabling precise positioning and minimal wire bond lengths while maintaining manufacturing simplicity
2Reliability
If wire bond length is minimized, then signal conduction efficiency improves, but alignment precision requirements increase
Solution Approach 1:
The patent incorporates pre-configured alignment marks and recesses on the substrate before component placement, enabling automated pick-and-place machines to achieve precise alignment without requiring post-placement adjustment, thus minimizing wire bond lengths while maintaining manufacturability
Solution Approach 2:
The patent replaces manual or complex mechanical alignment systems with automated optical alignment systems that use pre-marked positions and robotic pick-and-place technology, achieving high precision alignment with minimal wire bond lengths
3Area of stationary object
If multiple optical components are integrated on a small substrate, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent arranges multiple optical components and their associated electrical interfaces in a compact nested layout on the substrate, with components positioned to minimize spacing while maintaining signal integrity and thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise alignment and reduced wire bond lengths between optical components and drivers, enhancing high-frequency signal conduction and quasi-hermetic sealing, thereby improving the performance and reliability of MCMs.
Implementation Method 1
microlenses for beam expansion
Data Source
AI summary
An optical multi-chip module (MCM) is provided. A printed circuit board (PCB) overlies a package bottom and has die contact regions, each having at least one electrical interface. A first die contact region is formed in a PCB top surface recess, and an optical component die has a bottom surface with an area about matching the PCB top surface recess. The optical component die has an optical port with microlens. An electrical component die has a bottom surface with at least one electrical interface connected to the second die electrical interface, which is connected to the first die electrical interface via a PCB trace. A wire bond is connected between the electrical component die and a package interconnection lead. A cover assembly connector has an optical port with a microlens, configured to communicate with the optical component die optical port, and a fiber port to accept an optical fiber.