Optical Element Substrate Cooling Channels With Laser-Ablated Precision

Solution Overview

Problem

Existing methods for creating temperature-regulating hollow structures in optical elements for EUV projection exposure apparatuses result in substrates with material inhomogeneity, leading to poor process speed and structural deviations, which are unsuitable for precise temperature regulation and stable optical performance.

Innovation Solution

Incorporating temperature-regulating hollow structures with defined average roughness and surface topography, using a combination of modification and ablation processes to form channels with precise geometry and curvature, ensuring high precision and quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If material is removed to create temperature-regulating hollow structures, then cooling capability is improved, but material inhomogeneities and surface roughness increase

Engineering Contradiction:

Improvetemperature regulation capabilityVSAvoidsurface roughness and material inhomogeneity

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by first creating a modified substrate material layer through laser modification before removing material to form hollow structures. This preliminary modification ensures that the laser beam creates a controlled affected zone with altered material properties, allowing subsequent material removal to produce smoother surfaces with average roughness Ra of 0.1 μm to 5.0 μm, thereby resolving the contradiction between cooling capability and surface precision

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces traditional mechanical drilling or machining methods with laser-based modification and ablation processes. The laser beam modifies the substrate material through optical energy conversion, creating a controlled affected zone that enables precise hollow structure formation with superior surface finish compared to mechanical methods, thus improving manufacturing precision while maintaining cooling effectiveness

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If material removal processes are used to create hollow structures, then temperature regulation is improved, but process efficiency decreases

Engineering Contradiction:

Improvetemperature regulation capabilityVSAvoidprocess speed

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The patent applies preliminary action by first creating a modified substrate material layer through laser modification before removing material to form hollow structures. This preliminary modification ensures that the laser beam creates a controlled affected zone with altered material properties, allowing subsequent material removal to produce smoother surfaces with average roughness Ra of 0.1 μm to 5.0 μm, thereby resolving the contradiction between cooling capability and surface precision

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces traditional mechanical drilling or machining methods with laser-based modification and ablation processes. The laser beam modifies the substrate material through optical energy conversion, creating a controlled affected zone that enables precise hollow structure formation with superior surface finish compared to mechanical methods, thus improving manufacturing precision while maintaining cooling effectiveness

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If substrate material is removed to form cooling channels, then heat dissipation is improved, but shape stability deteriorates

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidshape stability and reflectivity

Core Design Contradiction:

TemperatureVSShape

Solution Approach 1:

The patent applies local quality by creating a modified substrate material layer with altered properties through laser modification. This modified layer has different characteristics from the bulk substrate, allowing controlled material removal that maintains overall substrate integrity. The selective modification enables formation of hollow structures with precise local properties while preserving the global shape stability and optical surface quality required for EUV reflectivity

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies preliminary action by first creating a modified substrate material layer through laser modification before removing material to form hollow structures. This preliminary modification ensures that the laser beam creates a controlled affected zone with altered material properties, allowing subsequent material removal to produce smoother surfaces with average roughness Ra of 0.1 μm to 5.0 μm, thereby resolving the contradiction between cooling capability and surface precision

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves precise and stable temperature regulation with minimal surface figure change over time, maintaining optical element performance and enabling production of structured electronic components with small features.

Implementation Method 1

using laser modification and ablation processes to define channels with controlled cross-sections and surface topography

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

heat is dissipated from the mirror by a temperature-regulating fluid in the form of a cooling fluid being made to flow through the temperature-regulating hollow structures

Methodology Applied

Scientific EffectConvection cooling: Convection

Data Source

PatentUS20260104572A1Substrate for producing an optical element, optical element and also semiconductor technology apparatus

Publication Date: 2026.04.16 CARL ZEISS SMT GMBH

AI summary

A substrate for producing an optical element and an optical element are specified. Furthermore, a semiconductor technology apparatus is specified.