Laminated Optical Substrate Wiring for Reliable Vertical Terminal Contact
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Solution Overview
Problem
Existing semiconductor photodiodes used in miniaturized optical devices face connection errors due to the fluidity of conductive materials forming a conical shape, reducing the contact area and leading to electrical connection issues between the wiring and connection terminals.
Innovation Solution
A laminated substrate design with multiple functional layers, where the electronic part is mounted in a sub-cavity, and connection terminals are connected to both first and second wirings via a conductive material, ensuring reliable electrical contact despite perpendicular orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive material is used to fill gaps between winding pattern and connection terminal, then electrical connection is achieved, but contact area reduces due to conical shape formation
Solution Approach 1:
The patent introduces a third dimension by forming a protrusion that extends upward from the mounting substrate surface. This vertical extension compensates for the conical shape reduction in horizontal contact area, maintaining reliable electrical connection by adding contact path in the vertical dimension rather than relying solely on horizontal area.
Solution Approach 2:
The protrusion is formed in advance before mounting the connection terminal, creating a pre-positioned contact structure. This preliminary formation ensures that when the terminal is mounted, the conductive material already has the optimal protruding shape to maximize contact area and minimize connection errors.
2Volume of moving object
If semiconductor photodiode is mounted with connection terminal perpendicular to substrate surface, then miniaturization is achieved, but connection error increases due to reduced contact area
Solution Approach 1:
The patent maintains the perpendicular mounting orientation for miniaturization while introducing a vertical protrusion element. This adds a third-dimensional contact path that compensates for the reduced horizontal contact area inherent in perpendicular mounting, thereby maintaining connection reliability despite the compact form factor.
Solution Approach 2:
The protrusion concentrates conductive material in a specific localized region where contact is most critical. This local enhancement of contact quality at the protrusion tip ensures reliable electrical connection specifically at the critical interface between mounting substrate and connection terminal, without affecting other parts of the device.
Data Source
AI summary
An optical device is provided, the optical device having a laminated substrate in which a plurality of functional layers are laminated, and an optical part and an electronic part disposed on the laminated substrate, wherein one of the functional layers is a first functional layer that the optical part is placed one, and one of other of the functional layers is a second functional layer that is disposed below the first functional layer and the electronic part is placed on, a first wiring is provided on one surface of the first functional layer and a second wiring is provided on one surface of the second functional layer, and a connection terminal of the electronic part is electrically connected to both of the first wiring and the second wiring via a conductive material.