Laminated Optical Substrate Wiring for Perpendicular Terminal Mounting
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Solution Overview
Problem
The challenge of reliably connecting a wiring disposed along one surface of a substrate and a connection terminal of an electronic part extending perpendicular to the surface is exacerbated by the fluidity of conductive materials used, leading to potential electrical connection errors.
Innovation Solution
The use of a laminated substrate with interlayer connections and a conductive material to ensure reliable electrical connections between first and second wirings, even when the connection terminal is mounted perpendicular to the extension direction of the second wiring, by filling gaps and ensuring a wide contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive material is used to fill gaps between winding pattern and connection terminal, then electrical connection is achieved, but contact area becomes smaller due to conical shape formation
Solution Approach 1:
The patent introduces a via hole penetrating through the substrate to create a vertical electrical connection path. This adds a third dimension (depth) to the connection structure, allowing the connection terminal to contact both the first wiring on the front surface and the second wiring on the back surface simultaneously, thereby increasing the effective contact area despite the conical shape of the conductive material.
Solution Approach 2:
The via hole acts as an intermediary structure that mediates the connection between the connection terminal and the wirings. By providing this intermediate pathway through the substrate, the patent enables reliable electrical connection while maintaining adequate contact area between the conductive material and the connection terminal.
2Adaptability or versatility
If connection terminal extends perpendicular to substrate surface, then mounting flexibility is improved, but connection error risk increases due to reduced contact area
Solution Approach 1:
By creating a via hole that penetrates through the substrate in the vertical direction, the patent enables the connection terminal to extend perpendicular to the substrate surface while maintaining reliable connection. The via hole provides a dedicated vertical pathway that ensures proper alignment and contact between the terminal and both wirings, preventing connection errors despite the perpendicular orientation.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the via hole provides a localized vertical connection pathway at the connection point, while the wirings extend horizontally on the substrate surfaces. This local differentiation allows the connection terminal to mount perpendicularly with high flexibility while maintaining connection accuracy through the specialized via hole structure.
3Device complexity
If single-layer substrate is used, then device complexity is reduced, but connection reliability between perpendicular terminal and planar wiring deteriorates
Solution Approach 1:
The patent segments the substrate into multiple functional layers: a front surface with first wiring, a back surface with second wiring, and a penetrating via hole connecting them. This segmentation allows each layer to perform its specific function independently, enabling reliable three-dimensional connection while maintaining relatively simple overall device complexity.
Solution Approach 2:
The patent transitions from a two-dimensional planar connection to a three-dimensional connection by introducing the via hole that penetrates through the substrate thickness. This dimensional change enables the connection terminal to contact wirings on both surfaces simultaneously, significantly improving connection reliability without requiring excessively complex multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents connection errors and ensures reliable conduction by securing a wide contact area between the connection terminals and wirings, enhancing the electrical connection stability.
Implementation Method 1
a connection terminal of the electronic part is electrically connected to both of the first wiring and the second wiring via a conductive material
Data Source
AI summary
An optical device is provided, the optical device having a laminated substrate in which a plurality of functional layers are laminated, and an optical part and an electronic part disposed on the laminated substrate, wherein one of the functional layers is a first functional layer that the optical part is placed one, and one of other of the functional layers is a second functional layer that is disposed below the first functional layer and the electronic part is placed on, a first wiring is provided on one surface of the first functional layer and a second wiring is provided on one surface of the second functional layer, and a connection terminal of the electronic part is electrically connected to both of the first wiring and the second wiring via a conductive material.