Optical Surface Figuring via Line-Removal Process
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sub-aperture finishing techniques for optical elements are limited by physical constraints, leading to long processing times, surface quality degradation, and edge exclusion issues, especially when dealing with large optical elements.
Innovation Solution
A method combining global and local figuring approaches using a line-removal process that scales to accommodate the full-width of the substrate, allowing for efficient removal of material across the entire aperture and varying orientations to achieve precise surface profiling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sub-aperture figuring techniques are used to correct high spatial period surface errors, then manufacturing precision is improved, but processing time increases significantly
Solution Approach 1:
The patent segments the surface correction process into two distinct modes: bulk removal mode for long spatial length errors and sub-aperture mode for high spatial period errors. This segmentation allows each mode to be optimized independently, achieving both high precision and reduced processing time by applying the appropriate mode to the appropriate error type.
Solution Approach 2:
The patent implements dynamic switching between bulk removal and sub-aperture modes based on the spatial frequency of the surface errors being corrected. The system adapts its processing approach in real-time, transitioning from aggressive bulk removal for low-frequency errors to precise sub-aperture processing for high-frequency errors, thereby optimizing both speed and precision.
2Manufacturing precision
If sub-aperture processing is used to achieve determinism in surface shaping, then manufacturing precision is improved, but surface quality and micro-roughness deteriorate
Solution Approach 1:
The patent applies local quality by using sub-aperture processing only where high precision is needed (for high spatial period errors) while using bulk removal for areas requiring less precision. This localized application of processing intensity maintains surface quality in regions where aggressive processing is unnecessary while achieving determinism only where required.
Solution Approach 2:
The patent uses partial action by applying sub-aperture processing selectively to correct only the high spatial period errors rather than processing the entire surface with high-precision methods. This partial application of deterministic processing achieves the necessary precision without the excessive roughness degradation that would result from applying sub-aperture processing uniformly across the entire surface.
3Manufacturing precision
If multiple processing techniques are combined to figure a single optical element, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent merges bulk removal and sub-aperture processing into a single integrated system that can switch between modes. Rather than requiring separate processing steps with multiple setups, the system combines both approaches in one apparatus, reducing the operational complexity despite maintaining both processing capabilities.
Solution Approach 2:
The patent creates a universal processing system that performs both bulk removal and sub-aperture figuring functions. The single system adapts its operation mode based on the processing requirements, eliminating the need for multiple specialized devices and reducing overall system complexity while maintaining high manufacturing precision.
4Manufacturing precision
If sub-aperture finishing is used for large optical elements, then manufacturing precision is improved, but productivity decreases due to long processing times
Solution Approach 1:
The patent employs periodic action by alternating between bulk removal phases and sub-aperture correction phases. The system periodically switches between aggressive material removal and precise surface shaping, maintaining high productivity during bulk removal while achieving high precision during sub-aperture phases, thereby increasing overall throughput for large optical elements.
Solution Approach 2:
The patent ensures continuity of useful action by seamlessly transitioning between bulk removal and sub-aperture modes without interrupting the processing workflow. The system maintains continuous material removal and surface correction, eliminating idle time and maximizing productivity while preserving manufacturing precision throughout the entire processing sequence.
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A method for figuring an optical surface of an optical element to achieve a target profile for the optical surface includes: applying a removal process to an extended region of the optical surface extending along a first direction to remove material from the extended region of the optical surface; adjusting a position of the optical surface relative to the removal process along a second direction perpendicular to the first direction to remove material from additional extended regions of the optical surface extending along the first direction at each of different positions of the optical surface along the second direction; and repeating the applying of the removal process and the adjusting of the optical surface relative to the removal process for each of multiple rotational orientations of the optical surface about a third direction perpendicular to the first and second directions to achieve the target profile of the optical surface.