Distributed Optical Switching Chip for Low-Latency Node Interconnects
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Solution Overview
Problem
Current data transmission and switching in high-performance computing systems rely heavily on electronic switching chips, which require optical-electrical-optical conversions, leading to high energy consumption and large delays, and existing optical switches are bulky, slow, and expensive, limiting the capacity and efficiency of data centers and computing systems.
Innovation Solution
A distributed optical switching and interconnect chip system with multiple nodes, each equipped with optical routing units, laser arrays, and photodetector arrays, utilizing cyclic array waveguide grating routers for efficient optical signal conversion and transmission without the need for high-end electronic switches, enabling direct connections through optical waveguides and reducing the need for optical-electrical-optical conversions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If electronic switching chips are used for data transmission, then switching capacity can be achieved, but optical-electrical-optical conversions result in high energy consumption and large delay
Solution Approach 1:
The patent replaces electronic switching with optical switching, substituting the mechanical/electronic conversion process with a purely optical system. The optical switching chip directly routes optical signals without requiring optical-electrical-optical conversions, thereby eliminating the energy consumption and delay associated with repeated conversions between different signal types.
Solution Approach 2:
The patent introduces an optical switching chip as an intermediary device that receives optical signals from transceivers and directly routes them to destination transceivers. This intermediary optical switch eliminates the need for electronic switching chips that would require signal conversion, thereby reducing both energy consumption and transmission delay.
2Productivity
If top-level electronic switching chips with high capacity are used, then switching capacity increases, but the requirement for top-level semiconductor process (5-7 nm) increases manufacturing complexity and cost
Solution Approach 1:
The patent segments the optical switching system into multiple independent optical switching chips that can be manufactured using standard semiconductor processes. Instead of requiring a single complex top-level electronic switching chip, the system divides the switching function across multiple simpler optical chips, each manufacturable with existing fabrication capabilities.
Solution Approach 2:
The patent substitutes electronic switching chips that require advanced semiconductor processes with optical switching chips that can be manufactured using standard semiconductor fabrication processes. This substitution maintains high switching capacity while significantly reducing manufacturing complexity and cost.
3Ease of manufacture
If wavelength selective switches based on LCOS or MEMS are used, then optical switching is achieved, but the devices become bulky, slow and expensive
Solution Approach 1:
The patent replaces bulky mechanical optical switching devices (LCOS or MEMS) with a compact optical switching chip that uses planar lightwave circuit technology. This substitution eliminates moving parts and mechanical complexity, resulting in a smaller, faster, and more cost-effective device that can be manufactured using standard semiconductor processes.
Solution Approach 2:
The patent transitions from three-dimensional mechanical optical switching devices to a two-dimensional planar lightwave circuit implementation. This dimensional change enables compact integration, faster switching speeds, and compatibility with standard semiconductor manufacturing processes, thereby reducing cost and improving performance.
4Device complexity
If electronic switching chips are used, then data transmission is possible, but the system requires optical transceiver modules or co-packaged optics to connect with external optical transmitters and receivers
Solution Approach 1:
The patent replaces electronic switching chips with an optical switching chip that natively handles optical signals. This substitution eliminates the need for optical transceiver modules or co-packaged optics that would be required to interface between electronic and optical domains, thereby simplifying system integration and reducing energy consumption from multiple conversion stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-capacity, low-power, and low-latency optical switching and interconnects between computing nodes, allowing for on-demand capacity expansion and fault protection, while eliminating waveguide crossings and reducing power consumption and latency.
Implementation Method 1
A laser array, connected to the internal input port of the optical routing unit, for converting electrical signals into optical signals
Implementation Method 2
A photodetector array, connected to the internal output port of the optical routing unit, for converting the optical signals received by the optical routing unit into electrical signals
Implementation Method 3
The external input/output ports of the optical routing unit are the input/output ports of the corresponding node, and the output ports of the node are connected to the input ports of other nodes through optical waveguides
Data Source
AI summary
This invention discloses a distributed optical switching and interconnect chip and system having multiple connected nodes, each node including an optical routing unit with one side having multiple internal input/output ports and the other side having multiple external input/output ports, a laser array and a photodetector array, connected to the internal input and output ports, respectively. The external output ports are connected to the external input ports of other nodes through optical waveguides. The signals received by the photodetectors can be dropped to the node or re-routed to the lasers by an electronic packet switching chip for re-transmission to other nodes. The invention integrates and encapsulates laser arrays, photodetector arrays, optical routing units and interconnection network in one chip. The distributed optical switching chip and system architecture have the advantages of high scalability, low latency and low power consumption, and can be used for multi-chip computing systems and datacenters.