Optical Contact Temperature Sensing for RF-Exposed Process Components
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Solution Overview
Problem
Semiconductor fabrication equipment components face harsh conditions due to RF energy and heat exposure, leading to accelerated degradation and difficulty in accurately measuring thermomechanical stresses, which complicates timely replacement and maintenance.
Innovation Solution
The implementation of optical contact temperature sensors, such as fiber Bragg Grating sensors, on components exposed to RF energy or heat, allowing for real-time temperature measurement at multiple locations without additional filtering or processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional temperature measurement methods are used in plasma processing equipment, then the measurement system is simple, but the measurement precision is insufficient under harsh RF energy and heat exposure conditions
Solution Approach 1:
The patent replaces traditional contact-based temperature sensors with optical fiber sensors that use light transmission properties to measure temperature. The optical fiber sensor detects temperature changes through variations in light transmission without direct thermal contact, eliminating the need for complex shielding and cooling systems required by traditional sensors in RF plasma environments.
Solution Approach 2:
The patent introduces optical fiber as an intermediary medium that transmits temperature information from the harsh plasma environment to the measurement system. The optical fiber acts as a mediator that is immune to RF energy interference while accurately conveying thermal data through changes in light transmission characteristics.
2Productivity
If components are replaced based on fixed schedules, then maintenance planning is simple, but productivity is reduced due to unnecessary replacements and downtime
Solution Approach 1:
The patent implements a real-time temperature monitoring system using optical fiber sensors that continuously feed back thermal data to the control system. This feedback mechanism enables the system to automatically detect when components reach critical temperature thresholds and trigger alerts for timely replacement, optimizing maintenance scheduling based on actual component condition rather than fixed intervals.
Solution Approach 2:
The patent enables preliminary detection of component degradation through continuous temperature monitoring. By detecting temperature changes before they lead to component failure, the system allows for planned maintenance activities to be scheduled in advance, preventing unexpected downtime and extending component life through proactive management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate, real-time temperature monitoring of component parts, informing timely replacement and reducing downtime and costs by ensuring components are replaced only when reaching specific exposure thresholds, thus extending their operational life.
Implementation Method 1
The optical contact temperature sensor is disposed on the component part and configured to determine a temperature of the component part
Implementation Method 2
optical contact temperature sensors, such as fiber Bragg Grating sensors
Data Source
AI summary
A semiconductor fabrication apparatus for processing one or more workpieces is provided. The apparatus includes one or more components exposed to radio frequency energy or heat and one or more optical contact temperature sensors disposed on the one or more components. Methods for measuring temperature of a component of a semiconductor fabrication apparatus are also provided.