Optical Test Apparatus with Lens Section for High-Throughput Device Testing
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Solution Overview
Problem
Conventional test apparatuses for devices with optical interfaces face challenges in throughput and cost due to the need for precise adjustment of optical axes, leading to increased manufacturing costs when devices do not perform as desired, often requiring rejection of the entire package.
Innovation Solution
A test apparatus that includes an optical coupler transmitting signals perpendicular to the device surface, utilizing a substrate with an optical transmission path and a lens section to focus optical signals, along with a moving section and control mechanisms to adjust the focal point and position, allowing for efficient optical and electrical signal exchange without precise optical axis alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise adjustment of optical axis is performed, then optical connection reliability is improved, but testing time increases and throughput decreases
Solution Approach 1:
The optical axis alignment is performed preliminarily during the packaging process rather than during testing. The optical connector is pre-aligned and fixed to the device under test before it is mounted on the substrate, so that no time-consuming adjustment is needed during the testing phase, thereby improving throughput while maintaining connection reliability
Solution Approach 2:
The manual or mechanical adjustment process for optical axis alignment is replaced with a fixed mechanical structure. The optical connector is mechanically fixed to the device under test at a predetermined position, eliminating the need for dynamic adjustment mechanisms during testing, thus reducing testing time while ensuring reliable optical connection
2Reliability
If precise adjustment of optical axis is performed, then optical connection reliability is improved, but testing cost increases
Solution Approach 1:
The costly optical axis alignment operation is moved to the packaging stage where it can be performed once during manufacturing. During testing, the pre-aligned optical connector is simply positioned on the substrate without requiring expensive adjustment equipment or skilled operators, thereby reducing testing costs while maintaining connection reliability
Solution Approach 2:
The expensive optical adjustment system required for precise alignment is replaced with a simple mechanical fixing structure. The optical connector is mounted at a predetermined position on the device under test using standard mounting techniques, eliminating the need for costly adjustment mechanisms and specialized testing equipment
3Reliability
If package is rejected when device under test does not perform, then product quality is improved, but manufacturing cost increases
Solution Approach 1:
The testing capability is segmented and integrated directly into the packaging substrate. The substrate includes dedicated test signal lines and optical connectors that enable independent testing of the device under test before final assembly. This allows defective devices to be identified and rejected individually without wasting the entire package, improving manufacturing efficiency while maintaining product quality
Solution Approach 2:
The packaging substrate itself provides the testing functionality through integrated test signal lines and optical connectors. The substrate structure includes built-in test circuits and optical paths that automatically enable testing when the device is mounted, eliminating the need for separate external testing equipment and reducing manufacturing costs while ensuring quality control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables successful optical and electrical connections between the device under test and the substrate, reducing testing time and costs by eliminating the need for precise optical axis adjustments and allowing high-speed testing of devices with optical interfaces.
Implementation Method 1
a lens section that is provided facing the optical coupler on the substrate and that focuses the optical signals from an end of one of the optical coupler and the optical transmission path to an end of the other
Data Source
AI summary
Provided is a test apparatus that tests a device under test including an optical coupler transmitting optical signals in a direction perpendicular to a device surface. The test apparatus includes a substrate on which the device under test is to be loaded, an optical transmission path that transmits the optical signals, and a lens section facing the optical coupler on the substrate that focuses the optical signals from an end of either the optical coupler or the optical transmission path to an end of the other.


