Optical Through Via Interposer for Conversion-Free 3DIC Signal Routing

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Solution Overview

Problem

Isolating photonic components onto a single side of a substrate or interposer in 3DIC structures necessitates converting optical signals to electrical signals using conductive through substrate vias (TSVs), which increases production costs and device size, and introduces signal transfer errors.

Innovation Solution

Employing optical through vias (OTVs) with reflective elements on opposite sides of the substrate or interposer to change the direction of optical signal propagation, utilizing tunable reflectors controlled by conductive elements or doped regions to direct signals without conversion, thereby reducing the need for additional components and minimizing signal re-conversion errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If optical signals are converted to electrical signals using conductive TSVs to isolate photonic components on a single side, then device layout flexibility is improved, but production cost increases and device size increases

Engineering Contradiction:

Improvedevice layout flexibilityVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent introduces an optical interposer with optical through vias as an intermediary component between the photonic die and electronic die. This optical interposer allows optical signals to pass through without conversion to electrical signals, eliminating the need for conductive TSVs while maintaining layout flexibility. The optical interposer acts as a mediator that preserves signal integrity and reduces device complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If optical signals are converted to electrical signals using conductive TSVs, then photonic component isolation is improved, but signal transfer reliability deteriorates due to conversion errors

Engineering Contradiction:

Improvephotonic component isolationVSAvoidsignal transfer reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent maintains the continuity of optical signals by allowing them to pass through the optical interposer and optical through vias without interruption or conversion. This continuous optical path eliminates the signal conversion process that introduces errors, thereby improving signal transfer reliability while still achieving photonic component isolation through the optical routing architecture.

Inventive Principle:

Principle #20Continuity of useful action

3Ease of manufacture

If conductive TSVs are used for signal transfer, then electrical signal routing is simplified, but device size increases due to additional components

Engineering Contradiction:

Improveelectrical signal routingVSAvoiddevice size

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The optical interposer serves multiple functions: it provides optical signal routing through optical through vias, enables photonic component isolation, and eliminates the need for separate conductive TSVs. This multi-functionality reduces the overall device size by consolidating what would otherwise require multiple separate components into a single integrated optical interposer structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces production costs and device size by eliminating unnecessary signal conversions, enhancing signal transfer reliability and precision within 3DIC structures.

Implementation Method 1

depositing a dielectric material into the opening, wherein the dielectric material has a first refractive index... depositing a core material into the core opening, wherein the core material has a second refractive index different from the first refractive index

Methodology Applied

Scientific EffectRefraction: Refraction

Implementation Method 2

Employing optical through vias (OTVs) with reflective elements on opposite sides of the substrate or interposer to change the direction of optical signal propagation

Methodology Applied

Scientific EffectReflection: Reflection

Data Source

PatentUS20250347862A1Method of making semiconductor device including optical through via and method of using

Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method of making a semiconductor device includes defining an opening extending from a first side of a substrate to a second side of the substrate, wherein the first side of the substrate is opposite the second side of the substrate. The method further includes depositing a dielectric material into the opening, wherein the dielectric material has a first refractive index. The method further includes etching the dielectric material to define a core opening extending from the first side of the substrate to the second side of the substrate. The method further includes depositing a core material into the core opening, wherein the core material has a second refractive index different from the first refractive index, and the core material is optically transparent. The method further includes removing excess core material from a surface of the substrate.