Optical Transceiver Connection Device High-Frequency Signal Integrity
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Solution Overview
Problem
Conventional connection methods for optical transceivers result in degraded high-frequency characteristics due to discontinuous GNDs and thick electric lines of force between signal lines and GNDs, leading to positional misalignment and insufficient connection strength, especially when trying to maintain high-frequency signal integrity above 40 GHz.
Innovation Solution
A connection device with a ground electrode layer on a substrate, a first transmission path on a dielectric layer, and leads connected to both, which are inserted into through-holes in a flexible substrate to ensure direct electrical connection, optimizing the gap between the signal line and GND to improve high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are connected to surface patterns on a multilayer ceramic substrate and inserted into through-holes of a flexible substrate, then connection is achieved, but high-frequency characteristics are degraded due to discontinuous GNDs and thick electric lines of force
Solution Approach 1:
The patent merges the signal transmission function and GND connection function into a single lead structure. The lead simultaneously serves as the signal transmission path and the GND connection path by directly connecting the inner-layer GND to the flexible substrate's GND layer, eliminating the need for separate GND vias and reducing structural complexity while improving high-frequency characteristics.
Solution Approach 2:
The lead acts as an intermediary element that directly connects the inner-layer GND of the multilayer ceramic substrate to the GND layer of the flexible substrate. This intermediary connection path reduces the thickness of electric lines of force and ensures continuous GND, thereby improving high-frequency signal transmission.
2Reliability
If the gap between signal line and GND is reduced to improve high-frequency characteristics, then high-frequency transmission is improved, but connection strength and positioning accuracy become insufficient
Solution Approach 1:
The patent moves the GND connection from a two-dimensional surface pattern connection to a three-dimensional through-hole connection. By inserting leads into through-holes that penetrate the flexible substrate, the connection is established in the thickness direction, providing mechanical strength while maintaining small gap dimensions for high-frequency performance.
Solution Approach 2:
The patent uses a composite connection structure combining the multilayer ceramic substrate, leads, and flexible substrate with through-holes. This composite structure integrates both the electrical connection function and mechanical strength function, allowing small gaps for high-frequency transmission while maintaining connection integrity through the rigid-flexible hybrid construction.
3Manufacturing precision
If leads are used to connect optical component terminals to the printed circuit board, then positional misalignment is compensated, but high-frequency characteristics are degraded due to discontinuous GND connections
Solution Approach 1:
The patent merges the signal transmission path and GND connection path into a single lead structure. The lead simultaneously serves as both the signal transmission path and the GND connection path by directly connecting the inner-layer GND to the flexible substrate's GND layer, eliminating discontinuous GND connections while maintaining positional flexibility.
Data Source
AI summary
A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.