Multi-channel Parallel Optical Transceiver Module Direct Soldering
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Solution Overview
Problem
Current multi-channel parallel optical transceiver modules are costly and suffer from signal quality issues due to the separation of optical devices and circuit boards, requiring long signal wires that hinder high-speed signal transmission.
Innovation Solution
A compact multi-channel parallel optical transceiver module design where the optical emitter base is soldered directly to the circuit board, reducing signal wire length and eliminating the need for flexible circuits, with all chips integrated on the board for simplified control and manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the optical device is separated from the circuit board and connected by flexible print circuit, then the manufacturing cost increases and signal wire length increases, but the optical device can be independently assembled
Solution Approach 1:
The patent merges the optical device assembly with the circuit board assembly by directly soldering the optical emitter base to the circuit board, eliminating the need for separate flexible print circuit connections. This integration reduces signal wire length and manufacturing cost while maintaining assembly feasibility through standardized soldering processes
2Ease of operation
If the optical device is separated from the circuit board and connected by flexible print circuit, then the optical device can be independently assembled, but the signal transmission quality deteriorates due to long signal wires
Solution Approach 1:
The patent combines the optical emitter base directly with the circuit board through soldering, reducing signal wire length to minimal traces. This integration maintains assembly independence through modular chip design while significantly improving signal transmission quality by minimizing wire length and associated losses
3Ease of manufacture
If all chips are integrated on the circuit board, then the manufacturing process is simplified and product quality is improved, but the device complexity increases
Solution Approach 1:
The circuit board is designed as a universal platform that integrates multiple functions: mechanical support for all chips, electrical interconnections through traces, optical signal routing, and shielding structures. This multi-functional design simplifies manufacturing by consolidating assembly steps while managing complexity through standardized interfaces and modular chip designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances high-frequency signal transmission quality, reduces production complexity, and minimizes space usage while lowering manufacturing costs by integrating components on the circuit board and shortening signal wires.
Implementation Method 1
Each of the optical emitters on the base may be associated with the laser and the lens located at the side adjacent to the circuit board
Implementation Method 2
Light is emitted from the laser and then passes through the lens and the optical isolator before coupling to the optical fiber located in the fiber pigtail
Implementation Method 3
The optical monitor may be connected to the laser by a bonding wire
Implementation Method 4
the optical emitter base engaged with the end of the circuit board may be soldered to two opposite sides of the circuit board
Data Source
AI summary
The present disclosure provides a multi-channel parallel optical transceiver module. The disclosed optical transceiver module/device may include a shell body and a circuit board located in the shell body, and an optical emitter base soldered to a first end of the circuit board. A notch located on the base, for engaging the first end of the circuit board, and the optical emitter base engaged with the first end of the circuit board may be soldered to two sides of the circuit board. The optical emitters may be disposed in parallel on the base, and separated from each other by a block. A lens and a laser may be disposed at a first side of each of the optical emitters that is adjacent to the circuit board, and an optical monitor may be disposed on a second end of the circuit board adjacent to the laser.