Optical Transceiver Electrode Layout for Low-Loss 800G Links
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Solution Overview
Problem
Existing high-speed optical transceivers face challenges in achieving wideband operation due to increased electrical loss and high frequency characteristics deterioration from long wiring lengths and impedance mismatches, particularly in CDM and DSP co-package forms, which hinder the realization of next-generation systems exceeding 800 Gbps.
Innovation Solution
A direct connection between the digital signal processing circuit and optical element packages using first and second electrodes, minimizing wiring length and reducing signal loss by aligning electrodes on both substrates for efficient high-speed signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If long wiring lengths are used to connect DSP and optical element packages in CDM or DSP co-package forms, then component integration is achieved, but electrical loss increases and high frequency characteristics deteriorate
Solution Approach 1:
The patent transitions from planar wiring connections to three-dimensional direct electrode-to-electrode connections between packages. By vertically aligning electrodes on the DSP package substrate and optical element package across multiple layers, the signal path length is dramatically reduced while maintaining integrated component architecture.
Solution Approach 2:
The patent extracts and eliminates the intermediate wiring layers and impedance matching structures from the signal transmission path. By directly connecting electrodes between packages through aligned contact holes, the harmful wiring inductance and resistance are removed, reducing electrical loss and improving high frequency characteristics.
2Device complexity
If long wiring lengths are used to connect DSP and optical element packages, then component integration is achieved, but impedance mismatch increases
Solution Approach 1:
The patent uses three-dimensional direct alignment of electrodes across package layers to eliminate long planar wiring paths. This vertical connection approach ensures consistent impedance throughout the signal path by removing variable wiring lengths that cause impedance mismatch, thereby improving signal integrity for high-speed operation.
Solution Approach 2:
The patent removes intermediate wiring segments and impedance matching networks from the signal path by directly connecting electrodes between packages. This extraction of unnecessary transmission elements eliminates cumulative impedance mismatches and ensures reliable high-frequency signal transmission.
3Speed
If wiring length is minimized through direct electrode connection, then signal speed and reduced loss are achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment marks and positioning structures during package fabrication to pre-establish precise electrode alignment before final assembly. This preliminary positioning action ensures that when electrodes are connected between packages, the required precision is achieved without increasing overall manufacturing complexity.
Solution Approach 2:
The patent introduces alignment marks and positioning features as intermediary elements that facilitate precise electrode alignment during assembly. These mediators enable accurate registration of electrodes across packages while simplifying the overall manufacturing process by providing clear alignment references.
Data Source
AI summary
An optical transceiver includes a pad formed on the surface of a DSP package substrate. an optical modulation module, a package that accommodates the optical modulation module, and a pad formed on the surface of the package, and the DSP package substrate and the package are directly connected to each other by the pad and the pad.