Optical Transceiver Module with External Circuit Board
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Solution Overview
Problem
Conventional optical transceiver modules are too large and bulky for use in small form-factor devices such as smartphones and tablets, which require high-speed data transfer and compact footprints.
Innovation Solution
The optical transceiver module design features a circuit board assembly with a connector shell that allows the circuit board to be disposed outside the shell, incorporating a faceplate with attachment features for securing the module, and includes a total internal reflection (TIR) module with GRIN lenses, enabling a compact footprint suitable for small devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical transceivers are housed within cages or shells with outer frameworks, then the transceivers can be securely inserted and locked into equipment, but the devices become relatively large and bulky
Solution Approach 1:
The circuit board is extracted from the traditional enclosure and positioned externally to the connector shell, eliminating the need for a large housing while maintaining secure connection capabilities through the connector shell and faceplate assembly
Solution Approach 2:
The circuit board is arranged in a different spatial configuration relative to the connector shell, with the board extending outside the shell rather than being contained within it, reducing the overall device volume while preserving functionality
2Productivity
If optical transceiver modules are designed for high data speed transfer, then bandwidth capacity is improved, but the modules become too large for small form-factor devices
Solution Approach 1:
The circuit board carrying high-speed optical components is extracted from the traditional enclosed module design and repositioned externally, allowing high data transfer capabilities to be achieved in a compact footprint suitable for small form-factor devices
Solution Approach 2:
The connector shell and faceplate provide a compact, thin-profile enclosure that accommodates high-speed optical components while maintaining a small footprint, enabling gigabit data transfer in devices like smartphones and tablets
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high-speed data transfer (5 GB/sec or greater) while significantly reducing the module's footprint, making it suitable for thin-profile electronic devices like smartphones and tablets with plug-and-play connectivity.
Implementation Method 1
An optical module such as a total internal reflection (TIR) module is disposed in the pocket of the connector shell
Implementation Method 2
The TIR module may include a plurality of GRIN lenses or integrally formed lenses
Data Source
AI summary
Disclosed are optical transceiver modules for use with electronic devices. In one embodiment, an optical transceiver module has a circuit board assembly for receiving and transmitting optical signals with a connector shell that is attached to the circuit board so that the circuit board is disposed outside the shell. The optical transceiver module also includes a faceplate that may have one or more attachment features for securing the faceplate and/or optical transceiver module to a device. By arranging the circuit board outside the shell of the optical transceiver module the footprint of the module is greatly reduced, thereby providing an advantageous arrangement for fitting into electronic devices having a relatively thin profile. Further, the optical transceiver module may optionally include one or more electrical contacts.