Optical Transceiver Heat Pipe Cooling for High-Speed Circuits

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Solution Overview

Problem

As transmission speeds of optical transceivers increase, the amount of heat generated by components such as receiving and transmitting circuits poses a cooling challenge, with existing heat dissipation methods being inadequate.

Innovation Solution

An optical transceiver design incorporating a heat sink, a heat conducting portion protruding from the case's inner wall in thermal contact with heat generating bodies, and a heat pipe that transfers heat from the conducting portion to the sink, enhancing heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If transmission speed of optical transceiver is increased, then data transmission capability is improved, but heat generation from components increases

Engineering Contradiction:
Improvedata transmission capabilityVSAvoidheat generation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat conducting portions, each thermally coupled to specific heat generating bodies. This allows targeted heat management for different components (receiving circuit, transmitting circuit, etc.) while maintaining high transmission speeds.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Heat conducting portions serve as intermediary elements between heat generating bodies and the heat sink. These portions are strategically positioned to conduct heat from various components to the heat sink, enabling effective heat dissipation without interfering with high-speed data transmission operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation is improved, then temperature of heat generating body is reduced, but device complexity increases

Engineering Contradiction:
Improvetemperature of heat generating bodyVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Multiple heat conducting portions are merged with the heat sink into an integrated heat dissipation system. This unified structure efficiently consolidates heat from multiple generating bodies while avoiding the complexity of separate cooling systems for each component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat sink serves as a universal heat dissipation component that handles heat from multiple different heat generating bodies simultaneously. This multi-functional approach reduces overall system complexity compared to dedicated cooling solutions for each component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively lowers the temperature of heat generating bodies by efficiently transferring and dissipating heat, improving cooling performance compared to conventional designs.

Implementation Method 1

a heat pipe transferring heat that the heat conducting portion receives from the heat generating body to the heat sink

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

heat conducting portion protruding from an inner wall surface of the case and in thermal contact with the heat generating body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230389232A1Optical transceiver
Publication Date: 2023.11.30 FUJIKURA LTD
  • US20230389232A1 patent drawing
  • US20230389232A1 patent drawing
  • US20230389232A1 patent drawing

AI summary

An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.