Optical Transceiver Hybrid Bonding Transparent Encapsulant

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Solution Overview

Problem

The fabrication process of optical transceiver modules is complex and results in severe optical loss, which is a challenge in high-speed optical communication systems requiring high performance, compact packaging, and low power consumption.

Innovation Solution

A process flow involving hybrid bonding of photonic and electric integrated circuit components with an optically transparent insulating encapsulant that covers the optical input/output portions and laterally encapsulates the electric integrated circuit components, minimizing optical loss and facilitating efficient signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional fabrication processes are used for optical transceiver modules, then manufacturing complexity is reduced, but optical loss increases severely

Engineering Contradiction:

Improveoptical lossVSAvoidfabrication process complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent merges the photonic integrated circuit component and electric integrated circuit component into a single hybrid assembly, where the electric component is disposed on the photonic component. This integration reduces the number of separate fabrication processes and minimizes optical loss by creating a compact, unified structure that eliminates intermediate coupling interfaces.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an insulating encapsulant as an intermediary material that covers the optical input/output portions of the photonic component and laterally encapsulates the electric component. This encapsulant serves as a mediator that provides electrical insulation while maintaining optical transparency, thereby reducing optical loss without complicating the fabrication process.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If compact packaging is achieved in optical transceiver modules, then device size is reduced, but fabrication complexity increases

Engineering Contradiction:

Improvetransceiver module sizeVSAvoidfabrication process complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent implements a nested structure where the electric integrated circuit component is disposed on and integrated with the photonic integrated circuit component. The insulating encapsulant then encapsulates both components, creating a compact nested arrangement that minimizes the overall transceiver module volume while using a systematic fabrication approach.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

By merging the photonic and electric components into a single hybrid assembly with the insulating encapsulant covering both, the patent achieves compact packaging. This unified structure reduces the total volume required compared to separate component arrangements, while the integrated fabrication process manages the complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If insulating encapsulant covers optical input/output portions, then electrical insulation is improved, but optical loss increases unless transparency is ensured

Engineering Contradiction:

Improveelectrical insulationVSAvoidoptical loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent applies local quality by ensuring the insulating encapsulant is optically transparent specifically at the regions covering the optical input/output portions. This allows the encapsulant to provide electrical insulation where needed (on the electric component) while maintaining optical transmission where required (at the optical interfaces), thus resolving the contradiction between insulation and optical loss.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the optical parameter (transparency) of the insulating encapsulant material to resolve the contradiction. By selecting or engineering the encapsulant material to have high optical transparency in the relevant wavelength range while maintaining electrical insulation properties, the patent achieves both electrical insulation and minimal optical loss simultaneously.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10333623B1Optical transceiver

Publication Date: 2019.06.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An optical transceiver including a photonic integrated circuit component, an electric integrated circuit component and an insulating encapsulant is provided. The photonic integrated circuit component includes at least one optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is disposed on and electrically connected to the photonic integrated circuit component. The insulating encapsulant covers the at least one optical input/output portion of the photonic integrated circuit component. The insulating encapsulant laterally encapsulates the electric integrated circuit component. The insulating encapsulant is optically transparent to the optical signal.