Optical Transceiver Heat Sink With Integral Fins for Lower Thermal Resistance

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Solution Overview

Problem

Existing optoelectronic transceiver modules face challenges with inefficient heat dissipation due to low thermal conductivity of adhesive materials and uneven application, leading to increased thermal resistance and higher costs.

Innovation Solution

A heat sink design featuring a shell body with integral fins and a shell top, secured by fasteners or adhesive, utilizing metals or metal alloys with high thermal conductivity to efficiently transfer heat to airflow passages for dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If adhesive materials are used to bond heat dissipation fins to the shell, then the heat dissipation capability is improved, but the thermal resistance increases due to low thermal conductivity of the adhesive

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidthermal resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent extracts the adhesive layer from the heat dissipation path by designing the fins to be integral with the shell body, eliminating the thermal resistance introduced by adhesive materials. The fins are directly formed as part of the shell structure, removing the intermediate adhesive layer that previously impeded heat flow.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the heat dissipation fins and shell body into a single integral structure. The fins are formed as an extension of the shell body itself, creating a unified thermal pathway that eliminates thermal resistance at the bonding interface and improves overall heat dissipation efficiency.

Inventive Principle:

Principle #5Merging (Combining)

2Strength

If adhesive materials are used to bond heat dissipation fins, then the fins can be attached to the shell, but the adhesive application becomes uneven leading to poor heat dissipation and detachment

Engineering Contradiction:

Improvebonding strengthVSAvoidadhesive application uniformity

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent removes the adhesive bonding process entirely by designing the fins as an integral part of the shell body. This eliminates the manufacturing variability and uneven application issues associated with adhesive materials, while maintaining strong structural attachment.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the fin and shell body into a single molded structure, eliminating the need for separate bonding operations. This integration ensures uniform structural properties throughout the heat dissipation pathway and prevents detachment issues.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If different materials are used for heat sink implementation, then the heat dissipation performance can be optimized, but the manufacturing costs increase

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines the shell body and heat dissipation fins into a single integral structure that can be manufactured as one piece using standard molding techniques. This eliminates the need for separate materials and bonding processes, reducing manufacturing complexity and cost while maintaining effective heat dissipation performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent designs the shell body to serve dual functions: structural housing and heat dissipation component. The integral fins are formed directly from the shell material, allowing the same material to fulfill both structural and thermal management roles, thereby simplifying the bill of materials and reducing overall manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat transfer efficiency and reduces manufacturing costs while maintaining reliable adhesion, improving thermal management in optoelectronic modules.

Implementation Method 1

The plurality of fins are configured to transfer heat to (i) air in the one or more airflow passages and (ii) the shell top

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

transfer heat to air in the one or more airflow passages

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

The shell top is in physical and/or thermal contact with the shell body and the plurality of fins

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250224577A1Optical transceiver module and methods of making and using the same

Publication Date: 2025.07.10 SOURCE PHOTONICS CHENGDU

AI summary

A heat sink for an optical or optoelectronic module, optical transceiver modules including the heat sink, and methods of making the heat sink and using the optical transceiver module are disclosed. The heat sink includes a shell body and a shell top. The shell body includes a metal or metal alloy, fins integral with the shell body and comprising the metal or metal alloy, and one or more airflow passages between adjacent fins. The shell top is in physical and/or thermal contact with the shell body and the fins, and includes the same or different metal or metal alloy. The shell top has opposing sidewalls including the same or different metal or metal alloy. The opposing sidewalls are configured to secure the shell top to the shell body. The fins are configured to transfer heat to (i) air in the airflow passage(s) and (ii) the shell top.