Optical Transceiver Packaging Density via Integrated Substrate
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Solution Overview
Problem
Existing optical transceivers face challenges in efficiently packaging high-speed, high-functionality components while maintaining compact size and reliable signal transmission due to misalignment of optical and electrical components, which affects packaging density and size reduction.
Innovation Solution
The optical transceiver design incorporates paired transmitter and receiver optical sub-assemblies arranged in a specific linear configuration with internal fibers and a printed circuit board, utilizing flexible print circuits and trays to align and connect components, ensuring efficient signal conversion and compact housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional lead frame connectors and individual lead penetration methods are used to join ROSA and TOSA to PCB, then electrical connections can be established, but the packaging density is reduced and the transceiver size increases
Solution Approach 1:
The patent combines multiple separate connection functions into a single integrated substrate. The substrate simultaneously provides mechanical support for ROSA and TOSA, electrical connection paths through integrated circuits, and optical signal routing through embedded fibers. This merging eliminates the need for separate lead frame connectors and individual lead penetration operations, thereby increasing packaging density and reducing transceiver size.
Solution Approach 2:
The substrate serves multiple functions concurrently: it acts as a mechanical platform for mounting optical components, provides electrical connection pathways through integrated circuits, routes optical signals through embedded fibers, and provides structural support for the entire assembly. This multi-functionality reduces the number of separate components needed, improving packaging density while maintaining compact dimensions.
2Reliability
If ROSA and TOSA are connected to PCB using traditional methods, then electrical signals can be transmitted, but misalignment between optical and electrical components occurs, affecting signal transmission reliability
Solution Approach 1:
The substrate integrates optical fiber routing channels and electrical circuit pathways in a unified structure, ensuring that optical and electrical components are precisely positioned relative to each other. This integrated design eliminates misalignment issues that occur with separate connection methods, as the relative positions of all components are determined during substrate manufacturing rather than through subsequent assembly operations.
Solution Approach 2:
The substrate acts as an intermediary structure that precisely positions and connects both optical components (ROSA, TOSA, fibers) and electrical circuits. This intermediate platform ensures accurate alignment between optical signal paths and electrical connection points, improving signal transmission reliability while maintaining manufacturing feasibility.
3Adaptability or versatility
If multiple separate components (ROSA, TOSA, lead frame connectors, PCB) are used, then functional requirements are met, but device complexity increases
Solution Approach 1:
The patent merges multiple discrete components (ROSA, TOSA, lead frame connectors, PCB) into a single integrated substrate structure. This substrate incorporates all necessary functional elements: optical component mounting areas, electrical circuits, fiber routing channels, and connection interfaces. The merging reduces component count and assembly complexity while maintaining all required functional capabilities.
Solution Approach 2:
The substrate is designed as a universal platform that performs multiple functions simultaneously: mechanical support, electrical connection, optical signal routing, and structural integration. This multi-functional design eliminates the need for separate specialized components, reducing device complexity while preserving full functional capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances packaging density, reduces the size of the transceiver, and ensures reliable signal transmission by aligning optical and electrical components, achieving high-speed performance and efficient signal processing.
Implementation Method 1
one of the paired ROSAs being optically connected to another of the first paired ports through a third fiber, another of the paired ROSAs being optically connected to another of the second paired ports through a fourth fiber
Implementation Method 2
paired transmitter optical sub-assemblies (TOSAs) each performing an electrical-to-optical signal conversion
Implementation Method 3
paired receiver optical sub-assemblies (ROSAs) each performing an optical-to-electrical signal conversion
Data Source
AI summary
An optical transceiver comprises an optical port, paired transmitter optical sub-assemblies (TOSAs), paired receiver optical sub-assemblies (ROSAs) and a printed circuit board (PCB) including an electrical circuit electrically connected to the paired TOSAs and the paired ROSAs. And the optical transceiver comprises a housing configured to house the optical port, the paired ROSAs, the paired TOSAs, and the PCB, so that the paired ROSAs are arranged between the optical port and the PCB in the first direction and the paired TOSAs are arranged between the paired ROSAs and the PCB in the first direction.