Optical Transceiver Module with Integrated Optical Windows
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Solution Overview
Problem
Existing optical transceiver modules using 850 nm wavelength VCSEL and photodiode devices are limited by complex and costly electrical packaging, which hinders high-speed performance due to parasitic inductance and capacitance.
Innovation Solution
The implementation of an optical transceiver module with an opto-chip that includes integrated optical windows and flip-chip attached optoelectronic devices, eliminating wire bonds by directly attaching OE devices to a transceiver or driver/amplifier IC chip, and subsequently to an organic or ceramic carrier, minimizing parasitic inductance and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wire bonds or intermediate electrical carriers are used to interconnect optoelectronic devices to driver ICs, then electrical connections can be established, but parasitic inductance and capacitance increase, limiting high-speed performance
Solution Approach 1:
The patent merges the optoelectronic devices and driver IC into a single integrated opto-chip structure, eliminating the need for separate wire bonds and intermediate carriers. This integration directly reduces parasitic inductance and capacitance, enabling high-speed data transmission greater than ten gigabits per second while simplifying the electrical packaging architecture.
Solution Approach 2:
The patent introduces an organic or ceramic carrier as an intermediate substrate that supports both the driver IC and optoelectronic devices in close proximity. This carrier enables direct electrical interconnection with minimal parasitics while providing mechanical support and optical pathways, resolving the contradiction between connection simplicity and packaging complexity.
2Ease of manufacture
If traditional side-by-side packaging with wire bonds is used, then electrical connections are established, but the module footprint and cost increase
Solution Approach 1:
By integrating multiple functional components (driver IC, optoelectronic devices, optical windows) into a single opto-chip, the patent dramatically reduces the module footprint while simplifying manufacturing. The integrated structure eliminates the need for complex wire bonding processes and intermediate carriers, reducing both manufacturing cost and assembly complexity.
Solution Approach 2:
The patent transitions from a planar side-by-side layout to a three-dimensional integrated structure where optoelectronic devices are positioned vertically above the driver IC. This vertical integration reduces the horizontal footprint while maintaining all necessary electrical and optical connections, achieving compactness without sacrificing manufacturing ease.
3Reliability
If optoelectronic devices are packaged in side-by-side configuration with intermediate carriers, then electrical interconnections are achieved, but high-speed performance is limited due to electrical packaging parasitics
Solution Approach 1:
The patent combines the driver IC and optoelectronic devices into a single integrated opto-chip structure, eliminating intermediate carriers and wire bonds. This integration minimizes parasitic inductance and capacitance, enabling reliable high-speed performance greater than ten gigabits per second while reducing packaging structure complexity.
Solution Approach 2:
The patent extracts and eliminates the problematic intermediate electrical carriers and wire bonds from the packaging structure. By removing these sources of parasitics, the design achieves high-speed performance reliability without the complexity of multi-layer packaging structures.
Data Source
AI summary
An optical module. The optical module includes an opto-chip. The opto-chip includes an integrated circuit with optical windows and a plurality of optoelectronic devices positioned in alignment with the optical windows. The plurality of optoelectronic devices are flip chip attached to the integrated circuit.