Optical Transceiver Peltier Layout for Compact Laser Cooling
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Solution Overview
Problem
Existing optical transceivers face challenges in reducing power consumption, size, and member costs, particularly in their cooling configurations.
Innovation Solution
The optical transceiver employs a Peltier element with a single-layer aluminum nitride substrates and a unique layout that integrates the laser chip, lens, and wiring pattern, eliminating unnecessary substrates and optimizing heat dissipation through innovative support structures and cooling methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional Peltier element with multiple substrates is used for cooling, then cooling performance is maintained, but power consumption, size, and member costs increase
Solution Approach 1:
The patent extracts and removes unnecessary substrates from the conventional Peltier element structure. Specifically, it eliminates the upper aluminum nitride substrate that is not directly involved in heat dissipation from the laser chip, retaining only the essential lower substrate for cooling functionality. This extraction reduces material usage and device complexity while preserving the core cooling performance.
Solution Approach 2:
The patent applies local quality by concentrating the cooling function specifically where heat is generated (at the laser chip location) rather than uniformly cooling the entire device. The Peltier element is positioned and configured to provide localized thermal management at the heat source, improving efficiency and reducing overall power consumption.
2Stability of the object's composition
If multiple substrates are used in the Peltier element, then structural stability is maintained, but device size and manufacturing costs increase
Solution Approach 1:
The patent removes redundant substrates from the Peltier element assembly, keeping only the essential lower aluminum nitride substrate that provides structural support and thermal conduction. This reduction in substrate count simplifies the device structure and reduces manufacturing complexity while maintaining adequate structural stability for the cooling function.
Solution Approach 2:
The patent merges the functions of multiple substrates into a single integrated lower substrate structure. The lower substrate simultaneously provides mechanical support, thermal conduction path, and structural stability, eliminating the need for separate upper substrate components and reducing overall device complexity.
3Temperature
If conventional cooling configurations are used, then heat dissipation is adequate, but device size and member costs increase
Solution Approach 1:
The patent extracts and eliminates unnecessary substrate layers from the cooling configuration, reducing the vertical height and material volume of the Peltier element assembly. By removing the upper substrate and simplifying the thermal path, the device achieves adequate heat dissipation with a more compact form factor.
Solution Approach 2:
The patent implements localized heat dissipation by positioning the Peltier element directly at the laser chip heat source and using a single substrate optimized for thermal conduction in that specific region. This localized approach improves heat dissipation efficiency per unit volume, reducing the overall device size required for effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power consumption, size, and member costs associated with cooling, while maintaining effective heat management and performance.
Implementation Method 1
a Peltier element including: a first aluminum nitride substrate having a single layer structure
Implementation Method 2
a first aluminum nitride substrate having a single layer structure and having a first surface and a second surface opposite the first surface; a second aluminum nitride substrate having a single layer structure, disposed away from the first aluminum nitride substrate
Data Source
AI summary
A Peltier element includes a first aluminum nitride substrate, a second aluminum nitride substrate, and a body supported between them. The body includes at least one semiconductor member, at least one first metal member, and at least one second metal member, the at least one first metal member and the at least one second metal member sandwiching the at least one semiconductor member. A laser chip is mounted to a first surface of the first aluminum nitride substrate. A lens is disposed off the first aluminum nitride substrate in a planar layout to intersect an imaginary plane including the first surface. A wiring pattern is electrically connected to the laser chip and is disposed directly on the first surface.