High Density Optical Transceiver Assembly Modular Cards
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Solution Overview
Problem
Conventional optical transceivers consume valuable motherboard space and are susceptible to single-point failures due to integrated multiple channels on a single PCB, making them expensive and prone to complete device replacement if a single component fails.
Innovation Solution
A high-density optical transceiver assembly with modular, discrete opto-electric cards mounted perpendicular to the motherboard, allowing for scalable configuration, flexible fiber routing, and easy replacement of defective cards, reducing the need for full transceiver replacement and minimizing real estate consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple channels are integrated onto a common interposer/PCB to achieve high-density transceiver, then channel capacity increases, but susceptibility to single-point failure increases and device complexity increases
Solution Approach 1:
The transceiver is divided into multiple independent channel modules, each with its own interposer and PCB. This segmentation allows individual channels to be replaced without affecting others, eliminating single-point failure while maintaining high channel capacity. Each module can be independently manufactured, tested, and replaced.
Solution Approach 2:
The patent transitions from planar integration (all channels on one PCB) to three-dimensional stacking (multiple PCBs stacked vertically with interposers). This dimensional change allows high channel density while maintaining physical separation between channels, enabling both high capacity and reliability.
2Ease of manufacture
If device PCB is mounted parallel to motherboard to achieve conventional transceiver configuration, then ease of manufacture is maintained, but valuable motherboard real estate is consumed
Solution Approach 1:
The patent changes the mounting orientation from parallel (2D plane) to perpendicular (3D vertical stacking). Multiple PCBs are stacked vertically with interposers between them, transforming the footprint from a large planar area to a compact vertical column, thereby minimizing motherboard real estate consumption.
Solution Approach 2:
The patent implements a nested structure where channel modules are stacked within a vertical space above the motherboard connection point. Each PCB is nested within the vertical envelope defined by the frame, with interposers nesting between PCB layers, creating a compact nested arrangement that minimizes horizontal space.
3Quantity of substance
If many channels are integrated onto common interposer/PCB to achieve high-density transceiver, then channel density increases, but device cost becomes prohibitively expensive
Solution Approach 1:
By segmenting the transceiver into standardized channel modules, each module can be manufactured independently using the same processes and materials. This modularity allows economies of scale in manufacturing individual modules, reducing the cost per channel compared to custom-integrated high-density PCBs.
Solution Approach 2:
The patent employs disposable/replaceable channel modules that can be individually replaced rather than replacing the entire expensive integrated transceiver. This approach reduces the effective cost by allowing selective replacement of only failed or outdated modules rather than the complete assembly.
Data Source
AI summary
A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.