Optical Transceiver Module Segmentation for Control Component Rework
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Solution Overview
Problem
Existing optical transceiver modules face challenges in reworking control components due to high-density arrangement and hermetic sealing, making component replacement difficult and often requiring module discard.
Innovation Solution
The optical transceiver module design includes a rigid circuit board with a control circuit and a flexible circuit board connected to a package, allowing independent placement of control, light receiving, and light emitting elements, enabling easy rework of control components and preventing short-circuiting with spacers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If control components are arranged with high density in the optical transceiver module, then the transmission capacity per rack is increased and the size of the optical transceiver is reduced, but it becomes difficult to perform rework such as replacement of the control components
Solution Approach 1:
The optical transceiver module is divided into distinct functional zones: a first region containing control components and a second region containing photoelectric conversion components and optical components. This spatial segmentation allows independent access to control components for replacement and maintenance without disturbing other components, thereby maintaining high transmission capacity while enabling ease of repair.
2Reliability
If the optical transceiver module is hermetically sealed to protect internal components, then reliability is improved, but it becomes difficult to rework components if a problem occurs
Solution Approach 1:
The hermetically sealed package is segmented into distinct functional regions with the control components located in a first region that is accessible for replacement. This allows the module to maintain hermetic sealing for reliability while providing a dedicated accessible area for component replacement and maintenance.
Solution Approach 2:
The control components are extracted from the deeply enclosed hermetic structure and positioned in a first region that is more accessible. This extraction allows maintenance personnel to access and replace control components without compromising the hermetic seal integrity of the overall module, thus maintaining reliability while enabling ease of repair.
3Speed
If photoelectric conversion components and optical components are arranged according to strict interface definitions, then the transmission speed is improved, but the area for arranging control components is limited
Solution Approach 1:
The module layout is segmented into a first region for control components and a second region for photoelectric conversion and optical components. This segmentation allows the photoelectric conversion components to be arranged according to strict interface definitions for high transmission speed, while simultaneously providing dedicated space for control components without interfering with each other.
Solution Approach 2:
The control components are positioned in a first region that utilizes available space in a different spatial dimension, allowing the photoelectric conversion components to occupy the second region with strict interface definition requirements. This dimensional arrangement solves the space conflict while maintaining both transmission speed and control component functionality.
Data Source
AI summary
An optical transceiver module includes a package containing a light receiving element, a light emitting element, and an optical modulator configured to modulate light that is output from the light emitting element, a rigid circuit board including a control circuit provided on the rigid circuit board, the control circuit being configured to control at least one of the light receiving element, the light emitting element, or the optical modulator, and a flexible circuit board including a plurality of signal wires, wherein the rigid circuit board is connected to the package via the flexible circuit board, with a first surface of the rigid circuit board facing a first surface of the package, and the at least one of the light receiving element, the light emitting element, or the optical modulator is electrically connected to the control circuit via the plurality of signal wires.