Optical Transceiver Peltier Layout for Lower-Power Laser Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical transceivers face challenges in reducing power consumption, size, and member costs, with insufficient focus on cooling configurations.
Innovation Solution
The optical transceiver employs a Peltier element with a single-layer aluminum nitride substrate and a support substrate that includes metal vias and insulator layers, eliminating unnecessary substrates and optimizing the layout to reduce thermal resistance and cooling requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional multi-layer substrate structure with separate cooling components is used, then thermal management is achieved, but power consumption, size, and member costs increase
Solution Approach 1:
The patent merges the substrate and cooling plate into a single integrated aluminum nitride substrate that serves both mechanical support and thermal management functions. The Peltier element is directly mounted on the back surface of this integrated substrate, eliminating the need for separate cooling components and reducing thermal resistance while lowering power consumption.
Solution Approach 2:
The patent uses aluminum nitride, a composite material with exceptional thermal conductivity and electrical insulation properties, to create a substrate that simultaneously provides structural support and efficient heat dissipation. This material choice enables effective thermal management without requiring additional active cooling components, thereby reducing overall power consumption.
2Temperature
If a conventional multi-layer substrate structure is used, then thermal management is achieved, but device size increases
Solution Approach 1:
The patent merges the substrate and cooling plate into a single integrated aluminum nitride substrate that serves both mechanical support and thermal management functions. The Peltier element is directly mounted on the back surface of this integrated substrate, eliminating the need for separate cooling components and reducing thermal resistance while lowering power consumption.
3Temperature
If a conventional multi-layer substrate structure is used, then thermal management is achieved, but member costs increase
Solution Approach 1:
The patent merges the substrate and cooling plate into a single integrated aluminum nitride substrate that serves both mechanical support and thermal management functions. The Peltier element is directly mounted on the back surface of this integrated substrate, eliminating the need for separate cooling components and reducing thermal resistance while lowering power consumption.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate layers and separate cooling components from the conventional multi-layer structure. By removing these redundant elements and retaining only the essential aluminum nitride substrate with integrated Peltier mounting, the design reduces component count and simplifies manufacturing while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power consumption, size, and member costs associated with cooling, while maintaining effective temperature management.
Implementation Method 1
a Peltier element including: a first aluminum nitride substrate having a single layer structure and having a first surface and a second surface opposite the first surface; a second aluminum nitride substrate having a single layer structure, disposed away from the first aluminum nitride substrate in one direction, and facing the second surface; and a body supported between the first aluminum nitride substrate and the second aluminum nitride substrate
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A Peltier element (PD) includes a first aluminum nitride substrate (211), a second aluminum nitride substrate (212), and a body (301) supported between them. The body (301) includes at least one semiconductor member (30), at least one first metal member (35), and at least one second metal member (35), the at least one first metal member and the at least one second metal member sandwiching the at least one semiconductor member. A laser chip (101) is mounted to a first surface of the first aluminum nitride substrate (211). A lens (110) is disposed off the first aluminum nitride substrate (211) in a planar layout to intersect an imaginary plane (IP) including the first surface. A wiring pattern (280) is electrically connected to the laser chip (101) and is disposed directly on the first surface.