Optical Transceiver Thermal Management via Deformable Resin
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical transceivers face challenges in efficiently dissipating heat generated by the optical modules, particularly due to misalignment between the module and the housing, which can lead to reduced coupling efficiency and increased thermal resistance.
Innovation Solution
The optical transceiver incorporates a deformable resin member and a heat conductive gel sandwiched between the optical module and the housing, with a fitting member that is detachably fixed to the housing, allowing for adjustable thickness of the resin member to accommodate misalignment and enhance heat dissipation by forming a high conductivity path between the module and the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid heat dissipating block is used to conduct heat from the optical module to the housing, then heat dissipation efficiency is improved, but misalignment between the module and housing causes increased thermal resistance and reduced coupling efficiency
Solution Approach 1:
The patent employs a deformable resin member instead of a rigid heat dissipating block. This resin member can elastically deform to accommodate misalignment between the optical module and housing, maintaining intimate thermal contact and ensuring efficient heat transfer while compensating for positioning tolerances.
Solution Approach 2:
The patent changes the physical state of the heat dissipating material from rigid to deformable. The resin member's ability to change shape under compression allows it to adapt to varying alignment conditions, transforming the thermal interface from a rigid contact to a compliant one that maintains optimal thermal coupling.
2Temperature
If the optical module is tightly fixed to the housing to improve heat dissipation, then thermal coupling is enhanced, but maintenance and replacement become difficult
Solution Approach 1:
The patent introduces a detachable fitting member that allows the optical module to be securely fixed during operation for optimal heat dissipation, yet easily removed when maintenance is needed. The fitting member can be attached and detached without damaging components, providing dynamic flexibility for both thermal management and maintenance purposes.
3Manufacturing precision
If a deformable resin member is used instead of a rigid heat dissipating block, then misalignment is accommodated and thermal contact is improved, but the structural strength may be reduced
Solution Approach 1:
The patent uses a composite structure combining a deformable resin member with a rigid fitting member. The resin member provides alignment tolerance compensation and thermal contact, while the fitting member provides structural support and detachable fixation. This composite approach combines the advantages of both rigid and deformable materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses positional deviations and stress on the optical module, improves heat dissipation, and facilitates easy maintenance by allowing for adjustable thickness of the resin member and easy detachment of components.
Implementation Method 1
a heat conductive member closely sandwiched between the package and the first plane
Implementation Method 2
The resin member closely sandwiched between the optical module and the fitting member
Data Source
AI summary
An optical transceiver according to one embodiment includes a housing having an inner space and inner planes that face to each other and define the inner space, a TOSA including a package and a sleeve attached to the package, the sleeve being fixed to the housing, the package being housed in the inner space, a heat conductive gel that is plastic or deformable and closely sandwiched between the package and one of the inner planes, a fitting member in contact with the other of the inner planes and detachably fixed to the housing, and a resin member closely sandwiched between the package and the fitting member.