Bi-directional Optical Transceiver Spacer for Electrical Isolation
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Solution Overview
Problem
Current bi-directional optical transceivers require separate fibers for optical transmission and reception, limiting their configuration and efficiency, particularly in adhering to industry standards like SFP transceivers which only define full-duplex configurations based on two optical fibers.
Innovation Solution
A bi-directional optical transceiver design incorporating a circuit board, optical subassembly, flexible printed circuit board, and spacer that electrically and thermally isolates lead pins, allowing for reliable electrical connection and heat dissipation while maintaining a compact, flexible form factor, enabling simultaneous optical transmission and reception with different signal wavelengths using a single fiber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bi-directional optical assembly is installed in an SFP transceiver, then the transceiver can perform optical transmission and reception with different wavelengths using a single fiber, but the lead pins may come into electrical contact with the stem causing short circuits
Solution Approach 1:
The patent introduces a non-conductive spacer as an intermediary component between the stem and the flexible printed circuit board. This spacer physically separates the lead pins from the stem, preventing electrical contact while maintaining the compact SFP transceiver structure. The spacer acts as a mediator that allows the bi-directional optical assembly to function without causing electrical short circuits.
2Device complexity
If the optical subassembly is directly mounted on the flexible printed circuit board, then the electrical connection is simplified, but the heat generated by the optical subassembly cannot be effectively dissipated
Solution Approach 1:
The non-conductive spacer serves as a thermal management intermediary by introducing a controlled air gap between the stem and the flexible printed circuit board. This gap facilitates heat dissipation from the optical subassembly while the spacer itself is positioned to allow thermal pathways to be managed effectively without compromising electrical isolation.
3Ease of manufacture
If excess solder is left in the gap between the stem and the flexible printed circuit board, then the manufacturing process is simplified, but the lead pins may come into electrical contact with the stem
Solution Approach 1:
The non-conductive spacer acts as a physical barrier that prevents excess solder from creating electrical contact between the lead pins and the stem. By positioning the spacer before the soldering process, it allows manufacturers to use standard soldering procedures without worrying about electrical isolation, as the spacer blocks any potential conductive pathways.
4Stability of the object's composition
If the transceiver uses a rigid structure to ensure stability, then the positioning is precise, but the flexibility and compactness required for SFP standards cannot be achieved
Solution Approach 1:
The patent employs a flexible printed circuit board with a non-conductive spacer to achieve the required flexibility for SFP transceiver integration. The spacer maintains structural stability and precise positioning of the optical subassembly while allowing the overall structure to remain flexible and compact, meeting SFP form factor requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable bi-directional communication with improved heat dissipation and electrical isolation, enhancing the flexibility and efficiency of the transceiver's design while adhering to industry standards, thus overcoming the limitations of separate fiber configurations.
Implementation Method 1
The ring portion may be thermally and electrically connected with the stem, while, the finger portion may be electrically. connected with a ground pattern provided on the circuit board. Thus, the stem may be thermally coupled with the ground pattern on the circuit board to secure a heat dissipating path from the optical subassembly to the circuit board.
Data Source
AI summary
The present invention is to provide an optical transceiver that installs a bi-directional optical sub-assembly. The bi-directional sub-assembly is installed within the transceiver and fixed by the holder with a pair of legs put the sub-assembly therebetween. By press-fitting these legs into respective pockets provided in the side of the transceiver, the sub-assembly is to be fixed with the housing. To press-fit the holder completes the fixing and the positioning of the sub-assembly at the same time.