Optical Transceiver Stacked Circuit Board Assembly
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Solution Overview
Problem
Conventional optical transceivers face challenges in accommodating increasing complexity and size due to higher operating speeds and functionality requirements, often necessitating multiple circuit boards which are difficult to install and manage effectively.
Innovation Solution
The optical transceiver employs a stacked configuration of a motherboard and daughter board with a holder made of insulating resin or plastic, using hooks and legs for assembly, along with a shield member and metal die-casting components for EMI shielding, and a pivotally assembled top cover for secure housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit boards are used to accommodate increasing complexity and functionality, then the optical transceiver can achieve higher operating speeds and more intelligent functions, but the device becomes harder to install and manage
Solution Approach 1:
The patent implements a stacked configuration where a daughter board is positioned above a motherboard, with both boards vertically aligned and electrically connected through conductive posts that pass through the motherboard. This nesting arrangement allows multiple circuit boards to occupy a compact vertical space while maintaining ease of installation through a unified housing structure.
Solution Approach 2:
The patent transitions from a horizontal arrangement of multiple circuit boards to a vertical stacked configuration. By utilizing the vertical dimension, the design accommodates increased complexity and functionality without expanding the horizontal footprint, thereby maintaining manageable installation and operation.
2Adaptability or versatility
If two circuit boards are stacked to accommodate complex circuits, then the optical transceiver can achieve higher functionality, but the assembly becomes more complex to manufacture
Solution Approach 1:
The patent combines the mounting functions for both the motherboard and daughter board into a single housing structure. The housing includes a recess that receives both boards simultaneously, with conductive posts integrated into the housing that electrically connect both boards to each other and to the optical subassemblies, simplifying the manufacturing process.
Solution Approach 2:
The housing structure serves multiple functions: it mounts both the motherboard and daughter board, provides electrical connections through integrated conductive posts, positions the optical subassemblies, and offers mechanical support for the entire stacked configuration. This multi-functionality reduces the number of separate components needed.
3Ease of manufacture
If a holder is used to stack the motherboard and daughter board, then the assembly is simplified, but additional components are required increasing device complexity
Solution Approach 1:
The patent merges the holder function directly into the housing structure. The housing includes a recess that receives both the motherboard and daughter board, and conductive posts are integrated into the housing rather than being separate components. This integration eliminates the need for a separate holder while maintaining the stacking functionality.
4Object-affected harmful factors
If shield members are added to shield EMI radiation, then EMI shielding effectiveness is improved, but the device complexity increases
Solution Approach 1:
The patent integrates EMI shielding functionality into the existing housing structure. The housing is made of metal material that provides EMI shielding, and the conductive posts serve dual purposes as both electrical connectors and shielding elements. This integration provides effective EMI protection without adding separate shield components.
Data Source
AI summary
An optical transceiver with two circuit boards is disclosed. The optical transceiver includes two OSAs, two circuit boards, and a holder put between two circuit boards. The circuit boards are assembled with the holder made of resin by the snap-in, and this intermediate product is set within the housing of the transceiver. The cover of the transceiver is also assembled by the snap-in without using screws and so on.