Optical Transceiver Heat Dissipation via Stacked Housing Design
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Solution Overview
Problem
Existing optical transceivers face challenges in efficiently dissipating heat generated by optical and electronic components, which can lead to increased temperatures and reduced reliability.
Innovation Solution
The optical transceiver employs a stacked housing design with separate heat conductive components thermally coupled to each housing, creating distinct heat dissipation paths for the first and second heat sources, thereby enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat dissipation path is used for all heat sources, then the device structure is simple, but the heat dissipation efficiency is insufficient and temperature control is poor
Solution Approach 1:
The patent divides the heat dissipation system into separate paths for different heat sources. The first heat conductive component is thermally coupled to the first housing, while the second heat conductive component is thermally coupled to the second housing, creating independent heat dissipation channels that prevent heat interference and improve overall temperature control efficiency.
Solution Approach 2:
The patent transitions from a single-plane heat dissipation approach to a three-dimensional stacked housing structure. The first and second housings are stacked vertically, with heat conductive components positioned in different spatial layers, enabling simultaneous heat dissipation from multiple heat sources without increasing planar footprint.
2Productivity
If heat conductive components are added to improve heat dissipation, then heat transfer efficiency improves, but device complexity increases
Solution Approach 1:
The first and second heat conductive components serve dual functions: they conduct heat away from respective heat sources and simultaneously act as thermal coupling elements between the heat sources and the housings. This multi-functionality reduces the need for additional dedicated heat dissipation components.
Solution Approach 2:
The heat conductive components are integrated within the stacked housing structure, with the first heat conductive component positioned in the first housing and the second heat conductive component positioned in the second housing. This nested arrangement maximizes space utilization and minimizes overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively separates the heat dissipation paths for different heat sources, leading to improved heat management and reduced temperatures, such as a decrease in the temperature of the second heat source from 76.18°C to 73.25°C.
Implementation Method 1
The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing
Implementation Method 2
The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing
Data Source
AI summary
An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.