Optical Transceiver Board Assembly With Detachable Thermal Connector
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Solution Overview
Problem
Network switch devices experience increased heat generation from both the switch ASIC and optical transceivers, necessitating an efficient heat dissipation mechanism that does not hinder the detachability of optical transceivers for maintenance and replacement.
Innovation Solution
A board assembly design featuring a substrate with detachable optical transceivers and heat dissipation mechanisms that are thermally connected but do not obstruct removal, utilizing connectors and heat dissipators aligned in directions opposite to the transceivers, allowing easy detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation mechanism is provided for optical transceivers, then heat dissipation efficiency is improved, but ease of replacement deteriorates
Solution Approach 1:
The heat dissipation mechanism is segmented into a fixed base portion attached to the substrate and a detachable connector portion that interfaces with the optical transceiver. This segmentation allows the heat dissipation function to remain while enabling easy removal of the transceiver by detaching only the connector portion.
Solution Approach 2:
The heat dissipation mechanism transitions from a static integrated structure to a dynamic modular structure where the connector can be detached. This dynamic design allows the system to switch between heat dissipation mode (connected) and replacement mode (detached), resolving the contradiction between heat dissipation efficiency and ease of replacement.
2Temperature
If a heat dissipation mechanism is integrated with optical transceivers, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation mechanism is designed as a universal interface that can serve multiple optical transceivers. The base portion remains fixed on the substrate while connectors can be attached to different transceivers, reducing overall device complexity through component sharing and standardization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and rapid removal of optical transceivers without interference from the heat dissipation mechanisms, ensuring efficient heat dissipation and reducing manufacturing complexity and costs.
Implementation Method 1
a heat dissipator that faces in a direction opposite to the first direction... and that is thermally connected to the heat dissipator
Data Source
AI summary
A board assembly includes: a substrate that has a first surface facing in a first direction and a second surface facing in a direction opposite to the first direction on a side opposite to the first surface and to which an optical transceiver including a first electric interface and a heat dissipator that face in the direction opposite to the first direction is fixed; and a first heat dissipation mechanism that includes a connector adjacent to the heat dissipator in the first direction and thermally connected to the heat dissipator in a state where the optical transceiver is fixed to the substrate and that is fixed to the substrate, the board assembly being configured such that the optical transceiver is detachable in a state where the first dissipation mechanism is fixed to the substrate.