Optical Transceiver Thermal Interface Structure for Stable Heat Transfer
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Solution Overview
Problem
Existing thermal interface materials for optical transceiver modules, such as gels and greases, fail to maintain effective thermal transfer due to drying, hardening, deformation, or residue issues, compromising heat dissipation and electrical contact integrity.
Innovation Solution
A thermal interface structure comprising a solid thermal interface material with a phase change material and polymer matrix, incorporating conductive fillers and a polymer layer, connected via adhesive layers to the transceiver module and heat sink, ensuring stable and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a gel thermal interface material is applied to the transceiver module, then thermal transfer is improved, but the gel dries out and hardens over time, compromising thermal transfer
Solution Approach 1:
The patent changes the physical state parameter of the thermal interface material from gel to solid, eliminating the drying and hardening issues inherent in gel materials. The solid material maintains consistent thermal properties over time while still providing effective heat transfer.
Solution Approach 2:
The patent uses a composite material consisting of solid thermal interface material combined with a polymer layer. This composite structure provides both effective thermal transfer and long-term stability, overcoming the limitations of pure gel materials.
2Temperature
If thermal interface grease is applied to mitigate interface gap variations, then thermal transfer is improved, but the grease cannot be applied to sufficient thickness and generates residues
Solution Approach 1:
The patent changes the application thickness parameter by using a solid material that can be applied in sufficient thickness unlike grease. The solid thermal interface material maintains its properties throughout the thickness and does not generate erosive residues.
Solution Approach 2:
The patent eliminates the need for disposable or replaceable thermal interface materials by using a solid material that maintains its properties over time without generating harmful residues that would require cleaning or replacement.
3Temperature
If gap pads are used for thermal transfer, then interface gap variations are mitigated, but filler erosion generates residues that negatively affect electrical contacts
Solution Approach 1:
The patent uses a composite material structure where the solid thermal interface material is combined with a polymer layer. This composite provides both thermal transfer capability and protection against electrical contact contamination, eliminating the residue generation problem of gap pads.
Solution Approach 2:
The patent eliminates the need for replaceable gap pads by using a solid thermal interface material that maintains its integrity and does not generate erosive residues that would contaminate electrical contacts.
4Temperature
If metal-to-metal contact is used between heat sink and transceiver module, then thermal transfer is achieved, but the fit is imprecise, compromising thermal transfer integrity
Solution Approach 1:
The patent changes the material state from solid metal to solid thermal interface material that can deform and conform to surface irregularities. This allows the material to compensate for manufacturing tolerances and achieve precise thermal contact without requiring imprecise metal-to-metal fitting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure provides reliable and consistent thermal conductivity, maintaining effective heat transfer and electrical contact integrity despite repeated insertions and removals, enhancing the operating performance of optical transceiver modules.
Implementation Method 1
a solid thermal interface material including a phase change material
Implementation Method 2
the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle
Data Source
Figure 1
Figure 2
Figure 3A~3E
AI summary
A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.