Optical Transceiver Module Thermal Isolation for Chip Heat Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical transceiver modules face challenges with poor heat dissipation due to heat generated by electrical chips being transferred to optical components, leading to excessive temperatures and difficulty in dissipating heat effectively.
Innovation Solution
The optical transceiver module design includes a housing with a top wall divided into heat-insulated regions, where one component dissipates heat through a first region and the other through a second region, with a heat sink mounted on the housing to manage heat transfer, and additional features like heat insulation layers and fastening members to prevent heat from being transferred between these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is used to dissipate heat for the optical module, then heat dissipation capability is improved, but heat generated by the chip still transfers to the optical component through the top wall, causing excessive temperature
Solution Approach 1:
The top wall is divided into a first region and a second region that are heat-insulated from each other. The chip is positioned in the first region while the optical component is positioned in the second region. This segmentation prevents heat generated by the chip from transferring to the optical component through the top wall, while both regions can independently dissipate heat outside the housing.
Solution Approach 2:
A heat insulation layer is introduced as an intermediary between the chip and the optical component, specifically between the first region and the second region of the top wall. This intermediary material blocks heat transfer pathways, preventing the chip's heat from reaching the optical component while allowing each component to dissipate heat independently through their respective regions.
2Adaptability or versatility
If the chip and optical component are mounted on the same substrate, then device integration is improved, but heat generated by the chip bakes the optical component, causing difficulty in heat dissipation
Solution Approach 1:
The housing top wall is segmented into heat-insulated first and second regions, creating spatial separation between the chip (first region) and optical component (second region). This segmentation maintains their integrated mounting on the same substrate while preventing thermal coupling through the top wall.
Solution Approach 2:
Different regions of the top wall are assigned different thermal properties: the first region allows heat dissipation for the chip, the second region allows heat dissipation for the optical component, and the interface between regions incorporates heat insulation. This local differentiation of thermal characteristics enables integrated mounting while preventing heat transfer from chip to optical component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents heat from the electrical chip from baking the optical component, improving the heat dissipation performance of the optical transceiver module by ensuring that heat is efficiently transferred outside the housing without affecting the optical component.
Implementation Method 1
a top wall of the housing has a first region and a second region that are heat-insulated from each other
Implementation Method 2
a heat sink mounted on the housing and configured to dissipate heat for one of the chip and the optical component
Implementation Method 3
dissipate heat outside the housing
Data Source
AI summary
An optical transceiver module includes a housing, a substrate, and a chip and an optical component that are mounted on the substrate. The housing has a receptacle that accommodates the chip, the optical component, and the substrate. A top wall of the housing has a first region and a second region that are heat-insulated from each other. One of the chip or the optical component dissipates heat outside the housing through the first region, and the other one of the chip or the optical component dissipates heat outside the housing through the second region. The first region and the second region that are heat-insulated from each other are used to dissipate heat for the optical component and the chip.