Optical Transmission Module Dielectric Block Stray Capacitance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing optical transmission modules experience significant degradation in frequency characteristics at high signal frequencies due to stray capacitance between the semiconductor plane and the temperature control surface, leading to dips in electro-optical response, which limits their bandwidth and waveform quality.

Innovation Solution

The optical transmission module incorporates a dielectric block with a vacant space between the semiconductor plane and the temperature control surface, filled with a dielectric substance, which reduces stray capacitance by increasing the relative dielectric constant, thereby improving frequency characteristics and extending bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the semiconductor plane is placed close to the temperature control surface for thermal management, then temperature control efficiency is improved, but stray capacitance increases causing degradation in frequency characteristics

Engineering Contradiction:
Improvetemperature control efficiencyVSAvoidfrequency characteristic
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

A dielectric block is introduced as an intermediary substance between the semiconductor plane and the temperature control surface. This dielectric block has a high relative dielectric constant that reduces stray capacitance while its thermal conductivity is optimized to maintain effective heat dissipation. The dielectric block thus mediates between the conflicting requirements of thermal management and electrical performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical and electrical parameters of the medium between the semiconductor plane and temperature control surface by using a dielectric block with specifically selected properties (high relative dielectric constant and appropriate thermal conductivity). This parameter change allows simultaneous achievement of reduced stray capacitance and maintained thermal control efficiency.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the distance between the semiconductor plane and temperature control surface is increased to reduce stray capacitance, then frequency characteristics are improved, but thermal control efficiency deteriorates

Engineering Contradiction:
Improvefrequency characteristicVSAvoidtemperature control efficiency
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

Instead of simply increasing the distance, the patent changes the material parameters by introducing a dielectric block with high relative dielectric constant and optimized thermal conductivity. This allows maintaining a compact structure while achieving reduced stray capacitance and effective thermal control simultaneously.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The dielectric block functions as a composite material solution that combines electrical insulation properties (high dielectric constant for capacitance reduction) with thermal conduction properties (optimized thermal conductivity for heat dissipation). This composite approach resolves the contradiction between electrical and thermal requirements.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional structures without dielectric blocks are used, then manufacturing is simpler, but stray capacitance causes significant degradation in high frequency performance

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidfrequency characteristic
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The dielectric block serves as an intermediary component that can be integrated into the existing manufacturing process. It mediates between the simple conventional structure and the need for high frequency performance, providing a straightforward solution that maintains manufacturing simplicity while dramatically improving frequency characteristics.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the frequency characteristic of the optical signal, reducing degradation and increasing the dip frequency, resulting in improved waveform quality and extended bandwidth up to 60 GHz, while also simplifying manufacturing and reducing component count.

Implementation Method 1

stray capacitance between the semiconductor plane and the temperature control surface

Methodology Applied
Scientific EffectStray capacitance: Parasitic Capacitance

Implementation Method 2

filled with a dielectric substance, which reduces stray capacitance by increasing the relative dielectric constant

Methodology Applied
Scientific EffectDielectric constant: Dielectric Permittivity

Implementation Method 3

a temperature regulating element provided between the dielectric block and the metal base in the first direction, the temperature regulating element being contacted with the thermal plane

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230077958A1Optical transmission module
Publication Date: 2023.03.16 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US20230077958A1 patent drawing
  • US20230077958A1 patent drawing
  • US20230077958A1 patent drawing

AI summary

An optical transmission module includes a metal base including a signal terminal which extends along a first direction, a dielectric block including a dielectric substance, the dielectric block having a semiconductor plane, an optical plane, and a thermal plane, the semiconductor plane and the optical plane being parallel to the first direction, the thermal plane crossing the first direction, and the semiconductor plane being provided between the optical plane and the thermal plane in the first direction, an optical semiconductor element mounted on the semiconductor plane, the optical semiconductor element being electrically connected with the signal terminal, a temperature regulating element provided between the dielectric block and the metal base in the first direction, the temperature regulating element being contacted with the thermal plane, and a lens mounted on the optical plane.