Optical Transmission Module Waveguide Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical transmission modules face challenges in efficiently transmitting optical signals between different layers due to incompatible fabricating processes and the need for complex metallic interconnections, leading to signal deflection and increased volume.
Innovation Solution
An optical transmission module utilizing a waveguide structure with total internal reflection, where the electronic component layer and photonic layer are connected on a semiconductor substrate with a dielectric film layer, allowing optical signals to be transmitted between different planes without vertical channels or metallic lines, enhancing signal transmission efficiency and reducing module volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the electronic component layer and the photonic layer are arranged at different sides, then the signal transmission paths can be deflected between different layers, but the module volume increases and the fabrication process becomes more complex
Solution Approach 1:
The patent uses a waveguide structure that extends vertically through the semiconductor substrate, allowing optical signals to transmit in the third dimension (depth) rather than only in the plane. This enables signal deflection between layers without increasing the horizontal footprint, resolving the contradiction between signal path flexibility and compact volume
2Ease of manufacture
If the electronic component layer and the photonic layer are arranged at the same side, then the fabrication process is simplified, but the signal transmission paths are limited to the same plane
Solution Approach 1:
The waveguide structure utilizes the vertical dimension by extending through the semiconductor substrate thickness, enabling optical signals to travel between different sides of the chip. This maintains the simplicity of same-side fabrication while adding three-dimensional signal routing capability that was previously impossible
3Reliability
If metallic lines are used to connect the electronic component layer and the photonic layer, then electrical signals can be transmitted, but the signal transmission efficiency decreases and the module volume increases
Solution Approach 1:
The patent replaces metallic electrical interconnections with optical waveguide structures. Instead of using metals to carry electrical signals between layers, the invention uses dielectric waveguides to transmit optical signals, achieving higher transmission efficiency and enabling longer transmission distances without the losses inherent in metallic conductors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables simplified fabrication, increased signal transmission efficiency, and reduced module volume by using a waveguide structure for total internal reflection, eliminating the need for complex metallic interconnections and enhancing optical signal transmission within the module.
Implementation Method 1
utilizing a waveguide structure with a semiconductor substrate, a first film layer, and an electronic component layer, where optical signals undergo total internal reflection
Data Source
AI summary
An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.