Optical Transmission Device Side-Electrode Markers
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Solution Overview
Problem
The downsizing of optical transmission modules is hindered by the lack of a marker for recognizing the arrangement of side-surface electrodes, leading to difficulties in automatic recognition and increased costs due to yield decrease and contamination issues, as well as mechanical stress on drive ICs in existing mounting configurations.
Innovation Solution
The optical transmission device incorporates side-surface electrodes with varying lengths and widths, formed on a silicon substrate, which serve as markers for easy recognition of their arrangement, allowing for automatic electrical connection and reducing component mounting height, while maintaining uniformity and pitch for reliable high-density optical transmission modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If side-surface electrodes are used for electrical connection, then electrical connection is achieved, but automatic recognition of electrode arrangement becomes difficult without markers
Solution Approach 1:
The patent applies visual differentiation by making certain side-surface electrodes protrude longer than others, creating distinguishable markers. This allows automatic recognition systems to identify electrode arrangements through visual detection of the protruding electrodes, transforming an invisible arrangement problem into a visually detectable one.
Solution Approach 2:
The patent introduces protruding electrodes as intermediary markers that mediate between the electrode arrangement and the automatic recognition system. These markers serve as visual cues that enable the recognition system to detect and interpret electrode positions without direct complex measurement of all electrodes.
2Reliability
If drive IC is mounted on the module, then electrical connection is established, but mechanical stress is applied to the drive IC
Solution Approach 1:
The patent transitions from planar electrode arrangement to three-dimensional arrangement by making certain electrodes protrude in the vertical dimension. This dimensional change allows the drive IC to be mounted on a separate substrate at a different height, connecting to protruding electrodes without applying mechanical stress to the IC itself.
Solution Approach 2:
The patent segments the electrical connection function into two parts: the protruding electrodes that provide both electrical connection and positioning reference, and the drive IC mounting area that can be separately optimized. This segmentation allows the IC to be mounted without stress while maintaining reliable electrical connections through the protruding electrode interface.
3Productivity
If conventional mounting configuration is used, then assembly is simplified, but component height increases and density decreases
Solution Approach 1:
The patent merges the functions of electrical connection and positioning reference into the protruding electrodes. This eliminates the need for separate markers and reduces the number of components, allowing for more compact vertical stacking and reduced overall module height while maintaining assembly simplicity.
Solution Approach 2:
By utilizing the vertical dimension with protruding electrodes, the patent enables compact horizontal integration of components. The drive IC can be mounted on a separate substrate at a different vertical level, reducing the horizontal footprint and enabling higher density while keeping the assembly process relatively simple.
Data Source
AI summary
According to one embodiment, a via holds an optical fiber and has an opening in at least a first surface of a silicon substrate. An interconnect is provided at a second surface of the silicon substrate and connected to an optical semiconductor element. Side-surface electrodes are provided at a third surface of the silicon substrate. The third surface is other than the first surface and the second surface of the silicon substrate. At least a portion of the side-surface electrodes is connected to the interconnect. At least a portion of the side-surface electrodes have different lengths along the third surface.