Optical Transmitter Layout for Low-Cost Fiber Coupling
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Solution Overview
Problem
Existing optical transmitter devices in optical communication systems face challenges with high production costs due to complex packaging designs and difficulties in encapsulating components like laser chips and lenses within limited space, which affects performance and efficiency.
Innovation Solution
The optical module employs a non-airtight encapsulation of the optical transmitter device with a substrate and circuit board, eliminating the need for a package and reducing material costs, while using focusing lenses and optical fiber adapters to enhance optical coupling efficiency by converging light onto internal optical fibers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional airtight packaging is used for optical transmitter devices, then component protection and environmental sealing are improved, but manufacturing complexity and production costs increase
Solution Approach 1:
The patent removes the traditional airtight package from the optical transmitter device, exposing the laser chip, lens, and other components directly to the external environment. The substrate serves as the mounting platform without requiring encapsulation, thereby eliminating packaging complexity while maintaining functional reliability through alternative protection methods.
Solution Approach 2:
The patent employs a substrate with protective coatings or thin film layers to protect exposed components from environmental damage. This approach provides necessary protection without the complexity of traditional airtight packaging structures, allowing direct mounting of optical components on the substrate.
2Volume of moving object
If more components are enclosed in limited space, then integration density is improved, but assembly difficulty and manufacturing precision requirements increase
Solution Approach 1:
The patent divides the optical transmitter device into separate functional modules mounted on the substrate, including the laser chip, lens, and optical fiber adapter as independent components. This segmentation allows each component to be manufactured and tested separately, then assembled on the substrate, reducing overall assembly difficulty while maintaining high integration density.
Solution Approach 2:
The patent utilizes the z-dimension (vertical height) by mounting components at different heights on the substrate, with the laser chip, lens, and optical fiber adapter positioned at varying elevations. This three-dimensional arrangement maximizes space utilization and integration density while keeping the footprint compact, and facilitates easier assembly compared to planar arrangements.
3Manufacturing precision
If optical components are precisely aligned, then optical coupling efficiency is improved, but manufacturing precision and alignment time increase
Solution Approach 1:
The patent incorporates pre-aligned mounting structures on the substrate, such as precision machined seats or adhesive pads with built-in alignment features, that automatically position the laser chip, lens, and optical fiber adapter in their correct relative positions during assembly. This preliminary preparation of alignment features eliminates time-consuming manual alignment operations while maintaining high optical coupling efficiency.
Solution Approach 2:
The patent uses the substrate as an intermediary platform with integrated alignment mechanisms that mediate the positioning between the laser chip, lens, and optical fiber adapter. The substrate includes features like alignment pins, precision bores, or patterned adhesives that automatically establish precise optical alignment when components are mounted, reducing the need for time-consuming post-assembly alignment adjustments.
4Reliability
If traditional packaging materials are used, then component protection is improved, but material costs and environmental impact increase
Solution Approach 1:
The patent eliminates traditional packaging materials such as epoxy encapsulants, metal cans, or plastic housings that are typically used to protect optical transmitter devices. By removing these material-intensive packaging structures, the design reduces material costs and environmental impact while maintaining component protection through the substrate and selective protective coatings.
Solution Approach 2:
The patent employs the substrate itself as a protective structure, potentially using composite materials that provide both mechanical support and environmental protection. The substrate may be made from ceramic, metal, or polymer composites that offer adequate protection against moisture and physical damage without requiring additional packaging layers, thereby reducing overall material usage and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and facilitates easier assembly, maintaining performance by ensuring effective heat dissipation and alignment of components, while improving optical coupling efficiency through precise alignment and convergence of light onto internal optical fibers.
Implementation Method 1
a focusing lens disposed between the laser chip and the optical fiber adapter and configured to converge light emitted by the laser chip to the optical fiber adapter
Implementation Method 2
the optical fiber adapter is configured to fix an internal optical fiber, the internal optical fiber being configured to transmit the optical signal emitted from the laser chip to an outside of the optical module
Data Source
AI summary
An optical module includes a circuit board and an optical transmitter device. The optical transmitter device includes a substrate, a spacer disposed on and electrically connected to the circuit board, a laser chip disposed on and electrically connected to the spacer, an optical fiber adapter disposed on the substrate in a light exit direction of the laser chip, a focusing lens disposed between the laser chip and the optical fiber adapter, light incident surface of the optical fiber adapter has a first inclination angle with respect to an axis of the optical fiber adapter, the axis of the optical fiber adapter being located in a plane parallel to the substrate, the optical fiber adapter is obliquely disposed on the substrate such that an axis of the internal optical fiber has a second inclination angle with respect to optical axis of the focusing lens.