Optical Transmitter Assembly Without Airtight Packaging
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Solution Overview
Problem
Existing optical transmitter devices have complex and costly packaging designs, making production difficult and expensive, and require airtight encapsulation which is not necessary for indoor use, increasing costs and complicating assembly due to limited space.
Innovation Solution
The optical transmitter device is encapsulated in a non-airtight manner with a substrate and circuit board assembly, eliminating the need for a package and using wire bonding for electrical connections, reducing material costs and simplifying production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If airtight encapsulation is used for the optical transmitter device, then reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the airtight package entirely from the optical transmitter device structure. The laser assembly is mounted directly on the circuit board without any enclosing package, extracting the unnecessary protective enclosure while maintaining device functionality in indoor environments.
Solution Approach 2:
The patent segments the optical transmitter device into discrete components (laser assembly, circuit board, shell) that can be independently assembled. The laser assembly is mounted on the circuit board which is then installed in the shell, allowing modular assembly without requiring airtight encapsulation of the entire device.
2Object-affected harmful factors
If a package is used for encapsulation, then protection is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent extracts and removes the package component from the optical transmitter device. The laser assembly is mounted directly on the circuit board without any package enclosure, eliminating the need for package assembly processes and reducing manufacturing complexity.
Solution Approach 2:
The patent merges the laser assembly directly with the circuit board by mounting the laser assembly onto the circuit board surface. This integration eliminates the intermediate package structure and simplifies the overall device architecture while maintaining electrical and optical connections.
3Object-affected harmful factors
If a package is used for encapsulation, then protection is improved, but assembly difficulty increases due to limited space
Solution Approach 1:
The patent removes the package structure that constrained component placement. Without the package enclosure, the laser assembly and circuit board can be positioned and assembled more freely, greatly simplifying the assembly process while maintaining adequate protection through the shell and adhesive mounting.
Data Source
AI summary
An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.