Optical Transmitter Substrate Integration for High-Density Compute
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Solution Overview
Problem
As the density of compute resources increases in server configurations and datacenters, the available space for ports and cabling decreases, leading to design constraints related to cabling, I/O architecture, topography, and thermal management.
Innovation Solution
The integration of optical transmitters and receivers within computing devices, supported by a substrate and in electrical communication with processing units, enables optical communication through open space or via waveguides, reducing or eliminating the need for physical cabling and additional I/O contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical wires and cabling are used for communication between processing units, then reliable data transmission is achieved, but the available space for ports and cabling decreases as compute resource density increases
Solution Approach 1:
The patent replaces the mechanical electrical cabling system with an optical communication system using light-based transmitters and receivers. This substitution eliminates the need for physical electrical connectors and cables, thereby freeing up space previously occupied by ports and cabling while maintaining reliable data transmission through optical signals.
Solution Approach 2:
The patent introduces optical transmitters and receivers as intermediary components that convert electrical signals to optical signals for transmission. These intermediaries enable communication without direct electrical contact, reducing the need for physical cabling infrastructure while ensuring reliable signal transfer between processing units.
2Productivity
If more ports and cabling are added to support increased compute density, then data communication capability is maintained, but device complexity and space requirements increase
Solution Approach 1:
The patent replaces complex electrical cabling architectures with simplified optical communication paths. By using light-based transmission through waveguides or free space, the system reduces the complexity of I/O architecture while maintaining or enhancing data communication capabilities across high-density compute resources.
Solution Approach 2:
The patent transitions from planar electrical connections to three-dimensional optical pathways, utilizing vertical waveguides or free-space optical channels. This dimensional change allows data communication to occur through space rather than requiring extensive lateral cabling, thereby reducing architectural complexity in high-density configurations.
3Productivity
If electrical cabling is used for communication, then data transmission is achieved, but thermal management becomes more difficult due to additional heat from cabling and ports
Solution Approach 1:
The patent substitutes electrical cabling with optical transmission, eliminating the resistive heating inherent in electrical conductors. Optical fibers and waveguides transmit data with minimal energy loss and heat generation, thereby reducing the thermal load on the system and simplifying thermal management in high-density compute environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies cabling and I/O architecture, enhances thermal management, and allows for data communication between components without interfering with the top surface of processing units or other electronic components.
Implementation Method 1
enables optical communication through open space or via waveguides
Data Source
AI summary
A computing device may include a substrate. A computing device may include a processing unit supported by the substrate. A computing device may include an optical transmitter supported by the substrate and in electrical communication with the processing unit.