Optical Transmitter Module Substrate Warpage Control
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Solution Overview
Problem
Existing optical modules face challenges in accurately controlling the temperature of semiconductor laser devices and optical modulators, leading to fluctuations in optical coupling efficiency due to substrate warpage, which affects the reliability of temperature controlling elements.
Innovation Solution
The optical transmitter, transmitter-receiver, and optical modules incorporate a temperature adjusting device with a substrate and middle block configuration, where the middle block is fastened to the substrate between temperature controlling elements, reducing substrate warpage and maintaining precise temperature control of semiconductor laser devices and optical modulators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If temperature controlling elements are installed on the substrate to control the temperature of semiconductor laser devices and optical modulators, then temperature control capability is improved, but substrate warpage occurs due to thermal stress, leading to fluctuations in optical coupling efficiency
Solution Approach 1:
The substrate is divided into multiple regions with different installation parts for temperature controlling elements. The substrate includes a first installation part for a first temperature controlling element and a second installation part for a second temperature controlling element, allowing localized temperature control while distributing thermal stress to minimize overall warpage.
Solution Approach 2:
Different regions of the substrate are designed with different properties to accommodate specific functions. The first installation part and second installation part have optimized local structures for mounting temperature controlling elements, while other regions maintain substrate flatness, creating local quality variations that resolve the contradiction between temperature control and overall stability.
2Adaptability or versatility
If multiple temperature controlling elements are installed on the substrate, then temperature control coverage is improved, but device complexity increases due to multiple installation parts and thermal management components
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for optical components, acts as a platform for installing multiple temperature controlling elements, and functions as a thermal management structure. The installation parts are designed to be universal, accommodating different types of temperature controlling elements and optical components through standardized interfaces.
Solution Approach 2:
Multiple functions are merged into the substrate structure. The installation parts for temperature controlling elements are integrated directly into the substrate rather than being separate components. The substrate combines structural support, thermal conduction, and component mounting functions, reducing overall device complexity while maintaining comprehensive temperature control coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of temperature control, reduces substrate warpage, and improves the reliability of optical coupling by minimizing stress on temperature controlling elements, thereby maintaining efficient optical coupling and stability.
Implementation Method 1
a first installation part provided on the principal surface of the substrate through a first temperature controlling element, the first installation part having the semiconductor laser device installed on the first installation part, and a second installation part provided on the principal surface of the substrate through a second temperature controlling element
Data Source
AI summary
An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.


