Optical Through-Silicon Via Waveguide Layout for 3D Chip Interconnects
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Solution Overview
Problem
Existing computerized communication systems face challenges in integrating optical integrated circuits with electronic integrated circuits within the same packaged computer chip to handle increasing data speeds while maintaining cost-effectiveness.
Innovation Solution
A co-packaged optics (CPO) integrated circuit chip is developed with a semiconductor substrate featuring optical through-substrate vias (TSVs) and waveguide optical circuits, enabling efficient optical signal transmission between layers using silicon-based posts and angled reflecting surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical integrated circuits are integrated with electronic integrated circuits within the same packaged chip to handle increasing data speeds, then data transmission capability is improved, but manufacturing complexity and fabrication difficulty increase
Solution Approach 1:
The patent segments the optical circuit fabrication into separate stages: forming optical through-substrate vias (TSVs) in the substrate wafer first, then bonding a separate mold wafer containing waveguide structures. This segmentation allows independent optimization of electronic and optical circuit fabrication processes, reducing overall manufacturing complexity while enabling high-speed data transmission through integrated CPO architecture
Solution Approach 2:
The patent utilizes the vertical dimension by creating optical TSVs that extend through the substrate thickness, enabling optical signals to transmit vertically between different layers of the packaged chip. This three-dimensional optical interconnect approach increases data transmission capability without expanding the planar footprint, effectively managing fabrication complexity through spatial optimization
2Speed
If optical through-substrate vias are formed to enable vertical optical signal transmission between layers, then data handling speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming the optical TSVs and their coupling structures in the substrate wafer before bonding the mold wafer. The TSVs are pre-configured with precise dimensions and positions, and the substrate wafer is thinned to appropriate thickness beforehand. This preliminary preparation establishes precise alignment references that guide subsequent mold wafer bonding, ensuring accurate optical coupling while maintaining high data handling speeds through the vertical optical paths
Solution Approach 2:
The patent introduces the thinned substrate wafer as an intermediary layer between the optical TSVs and the mold wafer containing waveguide structures. This intermediary substrate provides a precisely controlled bonding interface that facilitates accurate alignment between the vertical TSVs and horizontal waveguides, reducing manufacturing precision requirements for the final optical coupling while enabling high-speed vertical signal transmission
3Adaptability or versatility
If waveguide structures are bonded to optical TSVs to form integrated optical circuits, then optical signal routing capability is improved, but device complexity increases
Solution Approach 1:
The patent creates universal optical TSV structures that can couple with multiple different waveguide configurations and orientations. The optical TSVs serve as multi-functional interconnect elements that can route optical signals to various destinations within the packaged chip, enabling flexible optical signal routing capability. This universal TSV design reduces device complexity by using a standardized vertical coupling structure rather than requiring custom-designed optical paths for each routing requirement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The CPO chip enhances data transmission capabilities by allowing optical signals to be routed between different layers of the chip, improving data handling speeds and reducing costs through integrated optical and electronic circuits.
Implementation Method 1
angled reflecting surfaces
Data Source
AI summary
A semiconductor optical waveguide is provided. The semiconductor optical waveguide has a semiconductor substrate. The semiconductor substrate defines opposing top and bottom surfaces, and an optical TSV extending substantially perpendicular to the top and bottom surfaces. The semiconductor waveguide further includes a waveguide optical circuit on the semiconductor substrate and optically connected to the optical TSV.